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Milad Mahzari

Publications and source records attributed to Milad Mahzari.

23 records · Page 2

Dragonfly TPS Sizing and Analysis

Material response analysis methods and results for the design of the Dragonfly thermal protection system (TPS) are presented. The presentation is divided into two parts. In the first part, the primary components of the Dragonfly aeroshell TPS are described, and the methodology used for sizing the TPS materials are documented. In the second part, some modeling challenges unique to the Dragonfly/Titan entry problem are discussed.

Eric Stern↗

Thermostructural Qualification of PICA-D for NASA Planetary Science Missions

Phenolic Impregnated Carbon Ablator (PICA) has been used as the heatshield TPS material for many NASA planetary science missions. Due to a supply issue with the heritage Rayon fibers used in PICA fabrication, NASA started a project in 2017 to develop a sustainable replacement for PICA using a domestic fiber source, named PICA-D. This material has been selected as the heatshield TPS material for two upcoming NASA planetary science missions, Dragonfly mission to Titan and Mars Sample Retrieval Lander (SRL). While most PICA-D thermal and mechanical properties are very similar to PICA, early test data suggest that PICA-D is stiffer in tension in the in-plane (IP) direction, with higher strength but lower strain-to-failure. Preliminary thermostructural analysis using Finite Element Methods (FEM) tools predict IP compressive failure in the near-surface layers of PICA-D, for both Dragonfly and SRL flight environments. This talk provides an overview of the thermostructural qualification plans for PICA-D. A two-pronged approach is being pursued to demonstrate that the material and heatshield design has adequate capability for both SRL and Dragonfly design environments. The first part is to improve the accuracy of analytical predictions through a comprehensive characterization of PICA-D mechanical properties. The second, and more critical, part of the qualification approach is a subsystem-level test of PICA-D to demonstrate material capability under flight-relevant combined mechanical and thermal loads. The team is currently preparing for two test series in Sandia’s Solar Tower facility, scheduled in September 2023 and focusing on PICA-D acreage, followed by additional tests in the Solar Tower and LHMEL facilities focusing on design features and repair methods.

TPS↗

Mars Sample Retrieval Lander Thermal Protection System Design

The Mars Sample Return (MSR) Sample Retrieval Lander (SRL) was slated to launch in 2031 and enter Mars’ atmosphere after a 15-month cruise. After several iterations of vehicle design and trajectories, the latest mission architecture included a 4.72-meter diameter entry capsule entering the Martian atmosphere at 8 km/s, marking a 3.5x increase in kinetic energy when entering the atmosphere in comparison to Mars 2020. Designed to be the heaviest and fastest vehicle to enter Mars’ atmosphere, SRL required slim mass margins, and as such, the thermal protection system (TPS) design methodology needed to be tailored appropriately. The entry capsule aeroshell is composed of a heatshield, backshell, parachute support cone, and parachute lid, as shown in Fig. 1.

Hannah Alpert↗

Thermostructural Testing of PICA-D for NASA Planetary Science Missions

Phenolic Impregnated Carbon Ablator–Domestic (PICA‑D) has been selected as the heatshield thermal protection system (TPS) material for two upcoming NASA planetary science missions: the Dragonfly mission to Titan and the Mars Sample Retrieval Lander (SRL). Early testing revealed differences between PICA‑D and heritage PICA, particularly in in‑plane (IP) tensile stiffness and thermal expansion. Thermostructural analyses using Finite Element Method (FEM) tools subsequently predicted the potential for IP compressive failure in the near‑surface layers of PICA‑D under both Dragonfly and SRL flight environments. Over the past three years, the Dragonfly and SRL teams have carried out an extensive thermostructural qualification campaign to address these concerns and validate PICA‑D for flight. This effort began with a comprehensive mechanical property characterization program at Kratos test laboratories, which significantly improved understanding of PICA‑D mechanical behavior and increased the fidelity of FEM predictions. The teams also conducted six large‑scale test entries at the National Solar Thermal Test Facility (NSTTF) solar tower, exposing PICA‑D articles—including gap fillers and representative design features or flaws—to combined thermal and mechanical loads. The talk will summarize key findings from these mechanical and thermostructural test campaigns and present the current status of PICA‑D qualification for NASA’s planetary science missions.

TPS↗

Under Pressure: The Artemis I Heatshield Char Loss Investigation and Artemis II’s Successful Entry

Following the successful Artemis I skip reentry on December 11, 2022, unexpected char liberation from the Orion heat- shield prompted formation of an Anomaly Response Team to determine root cause and establish flight rationale and corrective actions for subsequent missions. Through a comprehensive investigation including detailed hardware analysis, modeling & simulation, and ground testing, the team determined that the low permeability Avcoat experienced extreme internal gas pressure buildup during the skip entry that could not adequately outgas, leading to crack formation and char liberation. Key discoveries included significant performance differences between permeable and impermeable heatshield regions and successful replication of the anomaly through ground testing. Based on extensive ground testing and analysis, Artemis II flew a modified trajectory without the skip entry to minimize crack-inducing conditions, and successfully splashed down on April 10, 2026 with significantly reduced char loss. For Artemis III and beyond, a corrective action was implemented to produce a more permeable version of Avcoat that will substantially reduce internal pressure accumulation during entry.

Artemis II↗