Engineering topics
Miller, Philip R.
Publications and source records attributed to Miller, Philip R..
Microfluidic package and method of making the same
The present invention relates to encapsulated microfluidic packages and methods thereof. In particular embodiments, the package includes a device, a cradle configured to support the device, and a lid having a bonding surface configured to provide a fluidic seal between itself and the device and/or cradle. Other package configurations, as well as methods for making such fluidic seals, are described herein.
Branch, Darren W.↗