Die Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications
Explore the source record for details and available documents.
Li, Xingchen↗
Engineering topics
Moon, Kyoung-sik
Publications and source records attributed to Moon, Kyoung-sik.
Antenna-Integrated, Die-Embedded Glass Package for 6G Wireless Applications.
Abstract not provided.
Jia, Xiaofan↗