DOE OSTI · 2431830
Die Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications
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Li, Xingchen, Jia, Xiaofan, Kim, Joon Woo, Moon, Kyoung-sik, Jordan, Matthew, Swaminathan, Madhavan. 2023-07-01. Die Embedded Glass Interposer with Minimum Warpage for 5G/6G Applications. https://doi.org/10.1109/ectc51909.2023.00389
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