Engineering topics
Publications and source records attributed to Moss, R. W..
Deposit, 5500-gram of Cu-0.15 wt % Zr alloy, sputtered onto copper cylinder to average thickness of 12.29 mm. Structure was achieved with high-rate sputter deposition for about 100 hours total sputtering time. Material had twice the strength of unsputtered material at temperatures to 723 K and equivalent strength at nearly 873 K.
Sputter-deposited alloys of dispersion-hardenable Cu-0.25 vol% SiC and Cu-0.50 vol% SiC and precipitation-hardenable Cu-0.15 wt% Zr and Cu-0.05 wt% Mg-0.15 wt% Zr-0.40 wt% Cr were investigated for selection to evaluate fatigue specimen performance with potential application in fabricating regeneratively cooled rocket thrust chambers. Yield strengths in the 700 to 1000-MN/sq m range were observed with uniform elongation ranging from 0.5 to 1.5% and necking indicative of greater ductility. Electrical conductivity measured as an analog to thermal conductivity gave values 90% IACS for Cu-0.15 wt% Zr and Cu-0.05 wt% Mg-0.15 wt% Zr-0.40 wt% Cr. A 5500-g sputtered deposit of Cu-0.15 wt% Zr alloy, 12.29 mm (0.484 in.) average thickness in the fatigue specimen gage length, was provided to NASA on one of their substrates.
Test results indicate that solder coating cells produces protective or deleterious effect, depending on the environment. Major problem for solder coated cells is in control of solder thickness and uniformity. Problem area for non-solder coated cells is not identified.