Engineering topics
Publications and source records attributed to Paulson, R..
Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.
Proposed apparatus for welding large arrays of solar cells to flexible circuit substrates would sense infrared emission from welding spot. Emission would provide feedback for control of welding heat. Welding platform containing optical fibers moves upward through slots in movable holding fixture to contact solar cells. Fibers pick up infrared radiation from weld area.