NASA NTRS · 19830000260
Detecting Defective Solder Bonds
Abstract
Method is noncontact and nondestructive. Technique detects solder bonds in solar array of other large circuit board, using thermal-imaging camera. Board placed between heat lamp and camera. Poor joints indiated by "cold" spots on the infrared image.
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Paulson, R., Barney, J., Decker, H. J.. 1984-04-01. Detecting Defective Solder Bonds. https://ntrs.nasa.gov/citations/19830000260
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