Standing on the Shoulders of Apollo: MEMS seismometers for the Lunar Geophysical Network
UNKNOWN
Panning, Mark P.↗
Engineering topics
Pike, William T.
Publications and source records attributed to Pike, William T..
The Seismic Experiment for Interior Structure (SEIS): Experiment Data Distribution
The six sensors of SEIS (The Seismic Experiment for Interior Structure) [- one of three primary instruments on NASA's Mars Lander Insight] cover a broad range of the seismic bandwidth, from 0.01 hertz to 50 hertz, with possible extension to longer periods. Data are transmitted in the form of three continuous VBB (Very Broad-Band) components at 2 samples per second (sps), an estimation of the short period (SP) energy content from the SP at 1 sps, and a continuous compound VBB/SP vertical axis at 10 sps. The continuous streams are augmented by requested event data with sample rates from 20 to 100 sps. SEIS data products are downlinked from the spacecraft in raw CCSDS (Consultative Committee for Space Data Systems) packets and converted to both the Standard for the Exchange of Earthquake Data (SEED) format files and ASCII tables (GeoCSV) for analysis and archiving. Metadata are available in dataless SEED and StionXML. Time series data (waveforms) are available in miniseed and GeoCSV. Data are distributed according to FDSN (Federation of Digital Seismograph Networks - http://www.fdsn.org) formats and interfaces. Wind, pressure and temperature data from the Auxiliary Payload Sensor Suite (APSS) will also be available in SEED format, and can be used for decorrelation and diagnostic purposes on SEIS.
Pardo, Constanza↗
Microwave bonding of MEMS component
Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.
Barmatz, Martin B.↗
Microwave bonding of thin film metal coated substrates
Bonding of materials such as MEMS materials is carried out using microwaves. High microwave absorbing films are placed within a microwave cavity containing other less microwave absorbing materials, and excited to cause selective heating in the skin depth of the films. This causes heating in one place more than another. This thereby minimizes unwanted heating effects during the microwave bonding process.
Barmatz, Martin B.↗
Transmission Electron Microscope Measures Lattice Parameters
Convergent-beam microdiffraction (CBM) in thermionic-emission transmission electron microscope (TEM) is technique for measuring lattice parameters of nanometer-sized specimens of crystalline materials. Lattice parameters determined by use of CBM accurate to within few parts in thousand. Technique developed especially for use in quantifying lattice parameters, and thus strains, in epitaxial mismatched-crystal-lattice multilayer structures in multiple-quantum-well and other advanced semiconductor electronic devices. Ability to determine strains in indivdual layers contributes to understanding of novel electronic behaviors of devices.
Pike, William T.↗
Subsurface Growth Of Silicide Structures In Silicon
Technique shows promise for fabrication of novel electronic, optoelectronic, and electro-optical devices. Experiments demonstrated feasibility of growing microscopic single-crystal CoSi2 structures beneath surfaces of Si substrates.
Fathauer, Robert W.↗