NASA NTRS · 20080007011
Microwave bonding of MEMS component
Abstract
Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material. This causes heating in one place more than another. Thereby minimizing the effects of the bonding microwave energy.
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Barmatz, Martin B., Mai, John D., Jackson, Henry W., Budraa, Nasser K., Pike, William T.. 2005-06-14. Microwave bonding of MEMS component. https://ntrs.nasa.gov/citations/20080007011
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