Engineering topics

Pratt, J. R.

Publications and source records attributed to Pratt, J. R..

15 records

NASA NTRS1990

Polyimides from a methylene-bridged dianhydride

High-molecular weight, high-temperature, highly optically transparent films suitable for electronic and aerospace applications were prepared based on a novel methylene-bridged dianhydride 3,3-prime bis(3,4-dicarboxyphenoxy) diphenylmethane dianhydride (PDMDA). All films had lower dielectric constants and significantly higher optical transparency than the commercial Kapton H film, with air-cured films having slightly higher dielectric constants and lower optical transparency than vacuum films, due to oxidative cross-linking.

Boston, Harold G.↗

NASA NTRS1989

Structure/permeability relationships of silicon-containing polyimides

The permeability to H2, O2, N2, CO2 and CH4 of three silicone-polyimide random copolymers and two polyimides containing silicon atoms in their backbone chains, was determined at 35.0 C and at pressures up to about 120 psig (approximately 8.2 atm). The copolymers contained different amounts of BPADA-m-PDA and amine-terminated poly (dimethyl siloxane) and also had different numbers of siloxane linkages in their silicone component. The polyimides containing silicon atoms (silicon-modified polyimides) were SiDA-4,4'-ODA and SiDA-p-PDA. The gas permeability and selectivity of the copolymers are more similar to those of their silicone component than of the polyimide component. By contrast, the permeability and selectivity of the silicon-modified polyimides are more similar to those of their parent polyimides, PMDA-4,4'-ODA and SiDA-p-PDA. The substitution of SiDA for the PMDA moiety in a polyimide appears to result in a significant increase in gas permeability, without a correspondingly large decrease in selectivity. The potential usefulness of the above polymers and copolymers as gas separation membranes is discussed.

Stern, S. A.↗

NASA NTRS1989

X-ray diffraction studies of model compounds of thermoplastic polyimides

Several model compounds which represent aspects of the chemical structure of the Langley Research Center thermoplastic (LARC-TPI) have been synthesized for comparison studies using wide angle X-ray scattering (WAXS) as the discriminatory tool. The model compounds included N-phenylphthalimide, 3,3',4,4'-benzophenonetetracarboxylic diphthalimide, and N,N'-diphenyl-3,3',4,4'-benzophenonetetracarboxylic diphthalimide. X-ray diffraction studies of appropriate model compounds can yield information to aid in the understanding of polymeric crystallographic structure. Crystallinity and physical property changes can thus be induced into materials having complicated structures by chemical and thermal processes.

Wakelyn, N. T.↗

NASA NTRS1987

Polyimide processing additives

A method has been found for enhancing the melt flow of thermoplastic polyimides during processing. A high molecular weight 422 copoly(amic acid) or copolyimide was fused with approximately 0.05 to 5 pct by weight of a low molecular weight amic acid or imide additive, and this melt was studied by capillary rheometry. Excellent flow and improved composite properties on graphite resulted from the addition of a PMDA-aniline additive to LARC-TPI. Solution viscosity studies imply that amic acid additives temporarily lower molecular weight and, hence, enlarge the processing window. Thus, compositions containing the additive have a lower melt viscosity for a longer time than those unmodified.

Pratt, J. R.↗

NASA NTRS1986

Investigation of the effects of short chain processing additives on polymers

The effects of low level concentrations of several short chain processing additives on the properties of the 4,4'-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA)/4,4'-diaminodiphenyl ether (ODA)/1,3'-diaminobenzene (m-phenylene diamine) (MPA) (422) copolyimide were investigated. It was noted that 5 percent MPD/phthalic anhydride (PA) is more effective than 5 percent ODA/PA and BDSDA/aniline (AN) in strengthening the host material. However, the introduction of 10 percent BDSDA/AN produces disproportionately high effects on free volume and free electron density in the host copolyimide.

Singh, J. J.↗

NASA NTRS1986

Solvent-Resistant, Thermally Stable Poly(Carbonate-Imides)

New polymers and copolymers based on polyimide backbone with carbonate moieties exhibit high temperature capability. Because of carbonate unit, many of these materials also exhibit high order or crystallinity. All of new imidecontaining polymers insensitive to acetone. New poly (carbonate-imide) exhibits significantly increased temperature resistance and shows less sensitivity to solvents than commercial polycarbonates.

St. Clair, T. L.↗

NASA NTRS1986

Poly (Carbonate-Mide) Polymer

A novel series of polymers and copolymers based on a polymide backbone with the incorporation of carbonate moieties along the backbone is presented. The preparation process for the polymers and copolymers is disclosed together with a novel series of dinitrodiphenyl carbonates and diaminodiphenyl carbonates. The novel polyners and copolymers exhibit high temperature capability and because of the carbonate unit, many exhibit a high degree of order and/or crystallinity.

St.clair, T. L.↗

NASA NTRS1985

Evaluation of experimental epoxy monomers

Future generation aircraft need higher performance polymer matrices to fully achieve the weight savings possible with composite materials. New resins are being formulated in an effort to understand basic polymer behavior and to develop improved resins. Some polymer/curing agent combinations that could be useful are difficult to process. In the area of epoxies, a major problem is that some components have physical properties which make them difficult to utilize as matrix resins. A previous study showed that the use of ultrasonic energy can be advantageous in the mixing of curing agents into a standard epoxy resin, such as MY 720 (Ciba-Geigy designation). This work is expanded to include three novel epoxides.

Hodges, W. T.↗

NASA NTRS1985

Synthesis and properties of copoly(carbonate imides)

Copoly(carbonate imides) with varying amounts of carbonate in the backbone were prepared by reacting 4,4-prime-diaminodiphenyl carbonate and 4,4-prime diaminodiphenyl ether with benzophenonetetracarboxylic acid dianhydride in dimethylacetamide at room temeprature. Homopolymers of the two diamines as well as of 3,4-prime- and 3,3-prime-diaminodiphenyl carbonate were prepared in a similar procedure and their properties compared with those of the copolymers.

Maudgal, S.↗

NASA NTRS1985

Evaluation of experimental epoxy monomers

Hodges, W. T.↗

NASA NTRS1981

Monomers for thermosetting and toughening epoxy resins

Eight glycidyl amines were prepared by alkylating the parent amine with epichlorohydrin to form chlorohydrin, followed by cyclization with aqueous NaOH. Three of these compounds contained propargyl groups with postcuring studies. A procedure for quantitatively estimating the epoxy content of these glycidyl amines was employed for purity determination. Two diamond carbonates and several model propargly compounds were prepared. The synthesis of three new diamines, two which contain propargyloxy groups, and another with a sec-butyl group is in progress. These materials are at the dinitro stage ready for the final hydrogenation step. Four aromatic diamines were synthesized for mutagenic testing purposes. One of these compounds rapidly decomposes on exposure to air.

Pratt, J. R.↗

NASA NTRS1976

New aromatic silicon-containing polyamides

The experiments described were aimed at studying systematically the effect of silyl linkages on the thermogravimetric and thermomechanical properties of aromatic polyamides. Specifically, 18 aromatic silicon-containing polyamides were synthesized via interfacial polymerization of six silicon-containing diacid chlorides with 3,3-prime-diaminodiphenylmethane, 3,3-prime-diaminobenzophenone, and 1-(3-prime-aminobenzyl)-4-(3-double prime-aminobenzoyl)benzene. All polyamides were soluble in m-cresol and N,N-dimethylacetamide, and had glass transition temperatures between 178 and 254 C. Thermogravimetric analysis conducted in static air on film specimens showed 5 and 10 percent weight losses between 331 and 400 C and 354 and 440 C, respectively. The potential gain in processability engendered by incorporation of silane substituents was offset in most cases by substantial losses in thermo-oxidative stability.

Pratt, J. R.↗

NASA NTRS1976

Novel aminobenzyl and imidobenzyl benzenes

Compounds are useful as intermediates for several classes of polymers. Amines can function as cross-linking agents for epoxide and urethane polymers, as well as intermediates for synthesis of thermally-stable addition-type polyimides. Imide derivatives can be obtained by reacting amines with certain monoanhydrides containing olefinic unsaturation.

Bell, V. L.↗

NASA NTRS1973

A novel imide synthesis via silyl-blocked diamines

Efforts have resulted in the production of some trimethylsilyl-blocked diamines, which have been employed in a novel manner for the synthesis of polyimide model compounds. Three new silicon-containing diamides were prepared by reacting 1 mol of bis-/N, N prime-bis (trimethylsilyl) -4-aminophonyl/-disubstituted silanes with 2 mol of phthalic anhydride, thus establishing the reactivity of fully silylated diamides in imide formation.

Pratt, J. R.↗

NASA NTRS1973

Organosilicon compounds. XVIII - Silicon-containing dianhydrides

Description of four new silicon-containing dianhydrides synthetized in an attempt to provide useful silicon-containing polyimide precursors. They were prepared by aqueous potassium permanganate-pyridine oxidations of corresponding tetramethyl intermediates to form tetracarboxylic acids, which were dehydrated to the dianhydrides.

Pratt, J. R.↗