Thermal cycling testing to failure of a ceramic column grid array package for space applications
UNKNOWN
Ramesham, Rajeshuni↗
Engineering topics
Ramesham, Rajeshuni
Publications and source records attributed to Ramesham, Rajeshuni.
Thermal cycling testing to failure of a ceramic column grid array package for space applications
Ceramic column grid array (CCGA) packages have been used increasingly in logic and microprocessor functions, telecommunications, flight avionics boards, payload electronics boards, engineering navigational and science cameras, electronic assemblies, and other applications, because of their inherent advantages such as high electrical interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount technology (SMT) packaging assembly processes. Because these advanced electronic packages tend to have less solder-joint strain-relief than do leaded flat-pack electronic packages, the reliability of CCGA packages in challenging thermal environments is a very important consideration for their short- and long-term use in JPL-NASA space missions. In this study, we assembled daisy chains of polyimide printed wiring boards from CCGA-interconnect packages, inspected the boards nondestructively, and then subjected them to thermal cycling to assess their reliability in thermal environments from +125°C to -40°C±25°C. The test hardware consists of a CCGA 1752 package (CN version). The package was divided into four daisy-chained sections that were electrically monitored for their continuity during thermal cycling. The CCGA 1752 package is roughly 45 mm × 45 mm with a 42-mm × 42-mm array of 80%/20% Pb/Sn columns on a 1.00-mm pitch. The resistance of the daisy-chained CCGA interconnects was continuously monitored during thermal cycling in a gaseous nitrogen environment. Electrical continuity resistance measurements as a function of thermal cycling are reported here; tests to date have shown significant change to an open circuit in daisy-chain resistance as a function of thermal cycling. The change in interconnect resistance becomes increasingly noticeable with increasing number of thermal cycles. This paper describes the experimental thermal-cycling test results of CCGA 1752 package reliability testing under an extremely wide temperature range. The first failure was observed at 1479th thermal cycle. We report the thermal-cycle reliability test data for ~2500 thermal cycles.
Ramesham, Rajeshuni↗
Solar Array (Radiated/Non-Radiated): Materials Characterization and Cryogenic Thermal Cycling Qualification for the Planned Europa Clipper Mission (ECM)
Two special instruments were custom built for our critical study and manufactured and employed to test the SA materials of interest to cryogenic temperature conditions. We have procured custom manufactured two independent systems such as Thermo -Mechanical Analyzer (TMA) with Three Point Bend Probe (TPBP) module and Dilatometer. TMA can be used to measure Young’ s modulus or elastic modulus (e -modulus). Dilatometer can be used to measure Co -efficient of Thermal Expansion (CTE). We have optimized the materials configuration to measure physical properties of radiated and non -radiated materials for CTE and e -modulus, which will be useful to assess materials and processes reliability for cryogenic temperature applications. We have successfully implemented for some materials that are of interest to solar panels for the planned ECM project to measure CTE and Young's modulus. Also a separate study was undertaken to thermal cycle qualify SAs for ECM project. One can do thermal cycling to temperatures of 50 K and 133 K using liquid Helium (Lq He). This is in reality exorbitantly too expensive and is also inefficient. Furthermore, this is not technically controllable test to 133 K and 50 K temperatures. This is also too expensive to accomplish. Therefore, a vacuum set -up was made along with a cryostat successfully. This is a closed loop system where we do not lose the Helium gas. We were able to get to 35 K for a given test coupon size. These temperatures are lower than what we would intend to qualify the solar array technologies. This will allow to have some margin at cold temperatures. We successfully completed the qualification of solar array technologies down to 50 K temperatures. This is the first time we are reporting this accomplishment. In this paper, we will present the solar array materials properties for cryogenic temperatures down to 20 K temperatures and the thermal cycling qualification test results from 133 K to 50 K for three times the mission life of 120 thermal cycles to meet JPL Design.
Ramesham, Rajeshuni↗
Solar Array (Radiated/Non-Radiated): Materials Characterization and Cryogenic Thermal Cycling Qualification for the Planned Europa Clipper Mission (ECM)
No abstract available
Ramesham, Rajeshuni↗
Robust Platinum Resistor Thermometer (PRT) Sensors and Reliable Bonding for Space Missions
Platinum resistance thermometers (PRTs) provide accurate temperature measurements over a wide temperature range and are used extensively on space missions due to their simplicity and linearity. A standard on spacecraft, PRTs are used to provide precision temperature control and vehicle health assessment. This paper reviews the extensive reliability testing of platinum resistor thermometer sensors (PRTs) and bonding methods used on the Mars Science Laboratory (MSL) mission and for the upcoming Soil Moisture Active Passive (SMAP) mission. During the Mars Exploration Rover (MER) mission, several key, JPL-packaged PRTs failed on those rovers prior to and within 1-Sol of landing due to thermally induced stresses. Similar failures can be traced back to other JPL missions dating back thirty years. As a result, MSL sought out a PRT more forgiving to the packaging configurations used at JPL, and extensively tested the Honeywell HRTS-5760-B-U-0-12 sensor to successfully demonstrate suitable robustness to thermal cycling. Specifically, this PRT was cycled 2,000 times, simulating three Martian winters and summers. The PRTs were bonded to six substrate materials (Aluminum 7050, treated Magnesium AZ231-B, Stainless Steel 304, Albemet, Titanium 6AL4V, and G-10), using four different aerospace adhesives--two epoxies and two silicones--that conformed to MSL's low out-gassing requirements. An additional epoxy was tested in a shorter environmental cycling test, when the need for a different temperature range adhesive was necessary for mobility and actuator hardware late in the fabrication process. All of this testing, along with electrostatic discharge (ESD) and destructive part analyses, demonstrate that this PRT is highly robust, and not subject to the failure of PRTs on previous missions. While there were two PRTs that failed during fabrication, to date there have been no in-flight PRT failures on MSL, including those on the Curiosity rover. Since MSL, the sensor has gone through a change in construction such that the manufacturer significantly restricts the minimum temperature. However, significant subsequent testing was performed with this new version of the part to show that it indeed is still robust to at least Mars minimum temperatures of -135 degrees Centigrade. The additional completed testing will be described. This work has resulted in a successful sensor package qualification and a reliable bonding method suitable for use over large temperature extremes
Platinum Resistor Thermometer (PRT)↗
Qualification of UHF Antenna for Extreme Martian Thermal Environments
The purpose of this development was to validate the use of the external Rover Ultra High Frequency (RUHF) antenna for space under extreme thermal environments to be encountered during the surface operations of the Mars Science Laboratory (MSL) mission. The antenna must survive all ground operations plus the nominal 670 Martian sol mission that includes summer and winter seasons of the Mars thermal environment.The qualification effort was to verify that the RUHF antenna design and its bonding and packaging processes are adequate to survive the harsh environmental conditions. The RUHF is a quadrifilar helix antenna mounted on the MSL Curiosity rover deck. The main components of the RUHF antenna are the helix structure, feed cables, and hybrid coupler, and the high-power termination load. In the case of MSL rover externally mounted hardware, not only are the expected thermal cycle depths severe, but there are temperature offsets between the Mars summer and winter seasons. The total number of temperature cycles needed to be split into two regimes of summer cycles and winter cycles. The qualification test was designed to demonstrate a survival life of three times more than all expected ground testing, plus a nominal 670 Martian sol missions. Baseline RF tests and a visual inspection were performed prior to the start of the qualification test. Functional RF tests were performed intermittently during chamber breaks over the course of the qualification test. For the RF return loss measurements, the antenna was tested in a controlled environment outside the thermal chamber with a vector network analyzer that was calibrated over the antenna s operational frequency range. A total of 2,010 thermal cycles were performed. Visual inspection showed a dulling of the solder material. This change will not affect the performance of the antenna. No other changes were observed. RF tests were performed on the RUHF helix antenna, hybrid, and load after the 2,010 qualification cycles test. The RF performance of the RUHF antenna, hybrid, and load were almost identical before and after the complete test. Therefore, the developed design of RUHF is qualified for a long-duration MSL mission. The RUHF antenna has not been used for long-duration missions such as MSL in the past. The state-of-the-art technology of the RUHF antenna is used to develop the antennas for MSL mission survivability. This developmental test data provides the confidence in using this RUHF antenna for future NASA missions to Mars.
Ramesham, Rajeshuni↗
Reliability of CCGA 1152 and CCGA 1272 Interconnect Packages for Extreme Thermal Environments
Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages of high interconnect density, very good thermal and electrical performance, and compatibility with standard surface-mount packaging assembly processes. CCGA packages are used in space applications such as in logics and microprocessor functions, telecommunications, flight avionics, and payload electronics. As these packages tend to have less solder joint strain relief than leaded packages, the reliability of CCGA packages is very important for short- and long-term space missions. Certain planetary satellites require operations of thermally uncontrolled hardware under extremely cold and hot temperatures with large diurnal temperature change from day to night. The planetary protection requires the hardware to be baked at +125 C for 72 hours to kill microbugs to avoid any biological contamination, especially for sample return missions. Therefore, the present CCGA package reliability research study has encompassed the temperature range of 185 to +125 C to cover various NASA deep space missions. Advanced 1152 and 1272 CCGA packaging interconnects technology test hardware objects have been subjected to ex treme temperature thermal cycles from 185 to +125 C. X-ray inspections of CCGA packages have been made before thermal cycling. No anomalous behavior and process problems were observed in the x-ray images. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of increasing number of thermal cycles. Electrical continuity measurements of daisy chains have shown no anomalies, even until 596 thermal cycles. Optical inspections of hardware have shown a significant fatigue for CCGA 1152 packages over CCGA 1272 packages. No catastrophic failures have been observed yet in the results. Process qualification and assembly are required to optimize the CCGA assembly processes. Optical inspections of CCGA boards have been made after 258 and 596 thermal cycles. Corner columns have started showing significant fatigue per optical inspection results.
Ramesham, Rajeshuni↗
Rover Low Gain Antenna Qualification for Deep Space Thermal Environments
A method to qualify the Rover Low Gain Antenna (RLGA) for use during the Mars Science Laboratory (MSL) mission has been devised. The RLGA antenna must survive all ground operations, plus the nominal 670 Martian sol mission that includes the summer and winter seasons of the Mars thermal environment. This qualification effort was performed to verify that the RLGA design, its bonding, and packaging processes are adequate. The qualification test was designed to demonstrate a survival life of three times more than all expected ground testing, plus a nominal 670 Martian sol missions. Baseline RF tests and a visual inspection were performed on the RLGA hardware before the start of the qualification test. Functional intermittent RF tests were performed during thermal chamber breaks over the course of the complete qualification test. For the return loss measurements, the RLGA antenna was moved to a test area. A vector network analyzer was calibrated over the operational frequency range of the antenna. For the RLGA, a simple return loss measurement was performed. A total of 2,010 (3 670 or 3 times mission thermal cycles) thermal cycles was performed. Visual inspection of the RLGA hardware did not show any anomalies due to the thermal cycling. The return loss measurement results of the RLGA antenna after the PQV (Package Qualification and Verification) test did not show any anomalies. The antenna pattern data taken before and after the PQV test at the uplink and downlink frequencies were unchanged. Therefore, the developed design of RLGA is qualified for a long-duration MSL mission.
Ramesham, Rajeshuni↗
Motor Qualification for Long-Duration Mars Missions
Qualification of motors for deep space under extreme thermal environments to be encountered during the Mars Science Laboratory (MSL) mission is required to verify the reliability and validate mission assurance requirements. The motor assembly must survive all ground operations, plus the nominal 670 Martian-day (or sol) mission that includes summer and winter seasons of the Mars environment. The motor assembly was tested and characterized under extreme temperature conditions with reference to hardware requirements. The motor assembly has been proved to be remarkably robust and displayed no sign of degradation due to the 3 X (three times per JPL design principles) thermal environmental exposure to the punishing Mars surface operations cycles. The motor characteristics obtained before, during, and post-test comparisons for the surface operations cycles are within measurement error of one another. The motors withstood/survived 2,010 extreme temperature cycles with a Delta T of 190 C deep temperature cycles, representing three times the expected thermal cycling exposure during the MSL surface operations. The qualification test hardware elements (A200 motor assembly, encoders, and resolver) have not shown any signs of degradation due to the PQV (Package Qualification and Verification) testing. The test hardware has demonstrated sufficient life to survive the deep thermal cycles associated with MSL mission surface operations for three lives.
Ramesham, Rajeshuni↗
PRTs and Their Bonding for Long-Duration, Extreme-Temperature Environments
Research was conducted on the qualification of Honeywell platinum resistance thermometer (PRT) bonding for use in the Mars Science Laboratory (MSL). This is the first time these sensors will be used for Mars-related projects. Different types of PRTs were employed for the Mars Exploration Rover (MER) project, and several reliability issues were experienced, even for a shortduration mission like MER compared to MSL. Therefore, the development of a qualification process for the Honeywell PRT bonding was needed for the MSL project. Reliability of the PRT sensors, and their bonding processes, is a key element to understand the health of the hardware during all stages of the project, and particularly during surface operations on Mars. Three extreme temperature summer season cycles and three winter season cycles (total: 1983 thermal cycles) were completed, and no Honeywell PRT failures associated with the bonding process were found. Seventy-eight PRTs were bonded onto six different substrate materials using four different adhesives during the thermal cycling, which included a planetary protection cycle to +125 C for two hours, three protoflight/qualification cycles (-135 to 70 C), 1,384 summer cycles (-105 to 40 C), and 599 winter cycles (-130 to 15 C). There were no observed changes in PRT resistances, bonding characteristics, or damage identified from the package evaluation as a result of the qualification tests.
Ramesham, Rajeshuni↗
Qualification of Engineering Camera for Long-Duration Deep Space Missions
Qualification and verification of advanced electronic packaging and interconnect technologies, and various other types of hardware elements for the Mars Exploration Rover s Spirit and Opportunity (MER)/Mars Science Laboratory (MSL) flight projects, has been performed to enhance the mission assurance. The qualification of hardware (engineering camera) under extreme cold temperatures has been performed with reference to various Mars-related project requirements. The flight-like packages, sensors, and subassemblies have been selected for the study to survive three times the total number of expected diurnal temperature cycles resulting from all environmental and operational exposures occurring over the life of the flight hardware, including all relevant manufacturing, ground operations, and mission phases. Qualification has been performed by subjecting above flight-like hardware to the environmental temperature extremes, and assessing any structural failures or degradation in electrical performance due to either overstress or thermal cycle fatigue. Engineering camera packaging designs, charge-coupled devices (CCDs), and temperature sensors were successfully qualified for MER and MSL per JPL design principles. Package failures were observed during qualification processes and the package redesigns were then made to enhance the reliability and subsequent mission assurance. These results show the technology certainly is promising for MSL, and especially for longterm extreme temperature missions to the extreme temperature conditions. The engineering camera has been completely qualified for the MSL project, with the proven ability to survive on Mars for 2010 sols, or 670 sols times three. Finally, the camera continued to be functional, even after 2010 thermal cycles.
Ramesham, Rajeshuni↗
Reliability of High I/O High Density CCGA Interconnect Electronic Packages under Extreme Thermal Environment
This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Ceramic column grid array (CCGA) packages have been increasing in use based on their advantages such as high interconnect density, very good thermal and electrical performances, compatibility with standard surface-mount packaging assembly processes, and so on. CCGA packages are used in space applications such as in logic and microprocessor functions, telecommunications, payload electronics, and flight avionics. As these packages tend to have less solder joint strain relief than leaded packages or more strain relief over lead-less chip carrier packages, the reliability of CCGA packages is very important for short-term and long-term deep space missions. We have employed high density CCGA 1152 and 1272 daisy chained electronic packages in this preliminary reliability study. Each package is divided into several daisy-chained sections. The physical dimensions of CCGA1152 package is 35 mm x 35 mm with a 34 x 34 array of columns with a 1 mm pitch. The dimension of the CCGA1272 package is 37.5 mm x 37.5 mm with a 36 x 36 array with a 1 mm pitch. The columns are made up of 80% Pb/20%Sn material. CCGA interconnect electronic package printed wiring polyimide boards have been assembled and inspected using non-destructive x-ray imaging techniques. The assembled CCGA boards were subjected to extreme temperature thermal atmospheric cycling to assess their reliability for future deep space missions. The resistance of daisy-chained interconnect sections were monitored continuously during thermal cycling. This paper provides the experimental test results of advanced CCGA packages tested in extreme temperature thermal environments. Standard optical inspection and x-ray non-destructive inspection tools were used to assess the reliability of high density CCGA packages for deep space extreme temperature missions. Keywords: Extreme temperatures, High density CCGA qualification, CCGA reliability, solder joint failures, optical inspection, and x-ray inspection.
high density CCGA qualifications↗
Qualification of Fiber Optic Cables for Martian Extreme Temperature Environments
Means have been developed for enabling fiber optic cables of the Laser Induced Breakdown Spectrometer instrument to survive ground operations plus the nominal 670 Martian conditions that include Martian summer and winter seasons. The purpose of this development was to validate the use of the rover external fiber optic cabling of ChemCam for space applications under the extreme thermal environments to be encountered during the Mars Science Laboratory (MSL) mission. Flight-representative fiber optic cables were subjected to extreme temperature thermal cycling of the same diurnal depth (or delta T) as expected in flight, but for three times the expected number of in-flight thermal cycles. The survivability of fiber optic cables was tested for 600 cumulative thermal cycles from -130 to +15 C to cover the winter season, and another 1,410 cumulative cycles from -105 to +40 C to cover the summer season. This test satisfies the required 3 times the design margin that is a total of 2,010 thermal cycles (670 x 3). This development test included functional optical transmission tests during the course of the test. Transmission of the fiber optic cables was performed prior to and after 1,288 thermal cycles and 2,010 thermal cycles. No significant changes in transmission were observed on either of the two representative fiber cables subject through the 3X MSL mission life that is 2,010 thermal cycles.
Ramesham, Rajeshuni↗
Qualifications of Bonding Process of Temperature Sensors to Deep-Space Missions
A process has been examined for bonding a platinum resistance thermometer (PRT) onto potential aerospace materials such as flat aluminum surfaces and a flexible copper tube to simulate coaxial cables for flight applications. Primarily, PRTs were inserted into a silver-plated copper braid to avoid stresses on the sensor while the sensor was attached with the braid to the base material for long-duration, deep-space missions. A1-1145/graphite composite (planar substrate) and copper tube have been used in this study to assess the reliability of PRT bonding materials. A flexible copper tube was chosen to simulate the coaxial cable to attach PRTs. The substrate materials were cleaned with acetone wipes to remove oils and contaminants. Later, the surface was also cleaned with ethyl alcohol and was air-dried. The materials were gently abraded and then were cleaned again the same way as previously mentioned. Initially, shielded (silver plated copper braid) PRT (type X) test articles were fabricated and cleaned. The base antenna material was pretreated and shielded, and CV-2566 NuSil silicone was used to attach the shielded PRT to the base material. The test articles were cured at room temperature and humidity for seven days. The resistance of the PRTs was continuously monitored during the thermal cycling, and the test articles were inspected prior to, at various intermediate steps during, and at the end of the thermal cycling as well. All of the PRTs survived three times the expected mission life for the JUNO project. No adhesion problems were observed in the PRT sensor area, or under the shielded PRT. Furthermore, the PRT resistance accurately tracked the thermal cycling of the chamber.
Ramesham, Rajeshuni↗
Reliability of Solder Materials (Sn-Pb and Pb-Free) for Deep Space Missions
The purpose of this study is to assess the experimental reliability results of miniaturized passive components (01005, 0201, 0402, 0603, 0805, and 1206) assembled using surface mounting processes with tin-lead (Sn-Pb) and lead-free (Pb-Free) solder alloys under extreme temperature deep space environments.
extreme temperatures↗
Coaxial Cables for Martian Extreme Temperature Environments
Work was conducted to validate the use of the rover external flexible coaxial cabling for space under the extreme environments to be encountered during the Mars Science Laboratory (MSL) mission. The antennas must survive all ground operations plus the nominal 670-Martian-day mission that includes summer and winter seasons of the Mars environment. Successful development of processes established coaxial cable hardware fatigue limits, which were well beyond the expected in-flight exposures. In keeping with traditional qualification philosophy, this was accomplished by subjecting flight-representative coaxial cables to temperature cycling of the same depth as expected in-flight, but for three times the expected number of in-flight thermal cycles. Insertion loss and return loss tests were performed on the coaxial cables during the thermal chamber breaks. A vector network analyzer was calibrated and operated over the operational frequency range 7.145 to 8.450 GHz. Even though some of the exposed cables function only at UHF frequencies (approximately 400 MHz), the testing was more sensitive, and extending the test range down to 400 MHz would have cost frequency resolution. The Gore flexible coaxial cables, which were the subject of these tests, proved to be robust and displayed no sign of degradation due to the 3X exposure to the punishing Mars surface operations cycles.
Ramesham, Rajeshuni↗
Reliability of Ceramic Column Grid Array Interconnect Packages Under Extreme Temperatures
A paper describes advanced ceramic column grid array (CCGA) packaging interconnects technology test objects that were subjected to extreme temperature thermal cycles. CCGA interconnect electronic package printed wiring boards (PWBs) of polyimide were assembled, inspected nondestructively, and, subsequently, subjected to ex - treme-temperature thermal cycling to assess reliability for future deep-space, short- and long-term, extreme-temperature missions. The test hardware consisted of two CCGA717 packages with each package divided into four daisy-chained sections, for a total of eight daisy chains to be monitored. The package is 33 33 mm with a 27 27 array of 80%/20% Pb/Sn columns on a 1.27-mm pitch. The change in resistance of the daisy-chained CCGA interconnects was measured as a function of the increasing number of thermal cycles. Several catastrophic failures were observed after 137 extreme-temperature thermal cycles, as per electrical resistance measurements, and then the tests were continued through 1,058 thermal cycles to corroborate and understand the test results. X-ray and optical inspection have been made after thermal cycling. Optical inspections were also conducted on the CCGA vs. thermal cycles. The optical inspections were conclusive; the x-ray images were not. Process qualification and assembly is required to optimize the CCGA assembly, which is very clear from the x-rays. Six daisy chains were open out of seven daisy chains, as per experimental test data reported. The daisy chains are open during the cold cycle, and then recover during the hot cycle, though some of them also opened during the hot thermal cycle..
Ramesham, Rajeshuni↗