Excess Heat Capacity in Mo/Au Transition Edge Sensor Bolometric Detectors
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Engineering topics
Publications and source records attributed to Regis Brekosky.
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The main objective was to reduce front-to back run-out-error and minimize wafer bow. We focused on: - DRIE recipe optimization - Gas flows - Etch timing - Power changes - Test of different substrates - Pyrex - Sapphire - Test of wafer adhesives