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Sawyer, J. W.

Publications and source records attributed to Sawyer, J. W..

At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1994

An instrumented fastener for shear force measurements in joints

A preliminary investigation has been conducted on instrumented fasteners for use as sensors to measure the shear loads transmitted by individual fasteners installed in double-splice joints. Calibration and load verification tests were conducted for instrumented fasteners installed at three fastener torque levels. Results from calibration tests show that the shear strains obtained from the instrumented fasteners vary linearly with the applied load and that the instrumented fasteners can be effectively used to measure shear loads transmitted by individual fasteners installed in double-splice joints. Tests were also conducted with three instumented fasteners installed in a typical double-splice joint. The test results showed that the load distribution between individual fasteners is dependent on the location of the fastener in the joint and the fastener torque level.

Sawyer, J. W.↗
NASA NTRS1985

Derivation and test of elevated temperature thermal-stress-free fastener concept

Future aerospace vehicles must withstand high temperatures and be able to function over a wide temperature range. New composite materials are being developed for use in designing high-temperature lightweight structures. Due to the difference between coefficients of thermal expansion for the new composite materials and conventional high-temperature metallic fasteners, innovative joining techniques are needed to produce tight joints at all temperatures without excessive thermal stresses. A thermal-stress-free fastening technique is presented that can be used to provide structurally tight joints at all temperatures even when the fastener and joined materials have different coefficients of thermal expansion. The derivation of thermal-stress-free fasteners and joint shapes is presented for a wide variety of fastener materials and materials being joined together. Approximations to the thermal-stress-free shapes that result in joints with low-thermal-stresses and that simplify the fastener/joint shape are discussed. The low-thermal-stress fastener concept is verified by thermal and shear tests in joints using oxide-dispersion-strengthened alloy fasteners in carbon-carbon material. The test results show no evidence of thermal stress damage for temperatures up to 2000 F and the resulting joints carried shear loads at room temperature typical of those for conventional joints.

Sawyer, J. W.↗
NASA NTRS1985

An investigation of the Iosipescu and Asymmetrical Four-Point Bend tests for composite materials

The results of an extensive analytical and experimental investigation of the Iosipescu and Asymmetrical Four-Point Bend (AFPB) test methods are summarized. Finite element analyses were used to assess the influence of notch parameters and load locations on the stress state in the specimens. The shear moduli and shear strengths were experimentally measured for quasi-isotropic graphite-epoxy laminates using both the Iosipescu and the AFPB test methods with various combinations of notch parameters and load locations. The test results indicate that changes in the notch geometry and load locations aimed at improving the stress distribution in the test section result in unexpected changes in the failure mode.

Spigel, B. S.↗
NASA NTRS1984

Effect of preforming adherends on static and fatigue strength of bonded composite single-lap joints

An analytical and experimental investigation was conducted on bonded composite single-lap joints with the adherends performed to reduce the angle between the line of action of the applied in-plane force and the bondline. A classical closed-form solution was used to analyze the composite joints with various preform angles and overlap lengths. The adherends of the test specimens were preformed before bonding, during the layup and curing process. Static tests were conducted for preform angles of 0, 5, 10, and 15 deg and overlap lengths of 0.75, 1.75, 2.75, and 3.75 in. A limited fatigue study was conducted for specimens with a 2.75-in. overlap and a preform angle of 5 deg. Results of the analysis showed that preforming the adherends of bonded composite single-lap joints significantly reduced the shear and peel stress concentrations in the adhesive. Experimental results showed that preforming the adherends significantly increased their static and fatigue strength and thus increased the load level for which bonded composite single-lap joints can be designed.

Sawyer, J. W.↗
NASA NTRS1983

Life considerations of the shuttle orbiter densified-tile thermal protection system

The Shuttle orbiter themal protection system (TPS) incorporates ceramic reusable surface insulation tiles bonded to the orbiter substructure through a strain isolation pad. Densification of the bonding surface of the tiles increases the static strength of the tiles. The densification proces does not, however, necessarily lead to an equivalent increase in fatigue strength. Investigation of the expected lifetime of densified tile TPS under both sinusoidal loading and random loading simulating flight conditions indicates that the strain isolation pads are the weakest components of the TPS under fatigue loading. The felt pads loosen under repetitive loading and, in highly loaded regions, could possibly cause excessive step heights between tiles causing burning of the protective insulation between tiles. A method of improving the operational lifetime of the TPS by using a strain isolation pad with increased stiffness is presented as is the consequence of the effect of increased stiffness on the tile inplane strains and transverse stresses.

Cooper, P. A.↗
NASA NTRS1983

Effect of strain isolator pad modulus on inplane strain in Shuttle Orbiter thermal protection system tiles

The thermal protection system used on the Space Shuttle orbiter to determine strains in the reusable surface insulation tiles under simulated flight loads was investigated. The effects of changes in the strain isolator pad (SIP) moduli on the strains in the tile were evaluated. To analyze the SIP/tile system, it was necessary to conduct tests to determine inplane tension and compression modulus and inplane failure strain for the densified layer of the tiles. It is shown that densification of the LI-900 tile material increases the modulus by a factor of 6 to 10 and reduces the failure strain by about 50%. It is indicated that the inplane strain levels in the Shuttle tiles in the highly loaded regions are approximately 2 orders of magnitude lower than the failure strain of the material. It is concluded that most of the LI-900 tiles on the Shuttle could be mounted on a SIP with tensile and shear stiffnesses 10 times those of the present SIP without inplane strain failure in the tile.

Sawyer, J. W.↗
NASA NTRS1983

Effect of stitching on the strength of bonded composite single lap joints

An experimental investigation has been conducted to determine the effect of stitching on the static and fatigue failure load of bonded composite single lap joints. The variables considered in the static tests included adherend thickness, overlap length, stitch spacing, and number of rows of stitches. A limited fatigue program was conducted for one configuration to compare the fatigue life of stitched and unstitched joints. Up to a 38 percent improvement in static failure load and an order of magnitude increase in fatigue life compared with unstiffened results are obtained by a single row of stitches near the end of the overlap. Additional rows of stitching or different stitch spacing has little effect on static joint failure load. Thicker adherends and larger overlap length result in larger improvements in static failure load with stitching. Further research is needed to refine the stitching process in order to obtain the maximum improvements in joint failure load.

Sawyer, J. W.↗
NASA NTRS1982

Mechanical properties of the Shuttle Orbiter thermal protection system strain isolator pad

An experimental investigation conducted to determine the static and fatigue properties of the Strain Isolator Pad (SIP) used on the Shuttle Orbiter Thermal protection system is described. Static tension-compression and shear test results show that the SIP is highly nonlinear and that it possesses a large hysteresis, a large low modulus region for low stress levels, and stress-strain properties that are highly sensitive to strain rate and previous load history. In addition, the shear properties are also found to be sensitive to forces applied normal to the plane of the pad and to the orientation of the material. For the undensified tile/SIP system, static and fatigue failure takes place at the SIP/tile interface at low stress levels and for a small number of cycles.

Sawyer, J. W.↗
NASA NTRS1982

Assessment of the Shuttle Orbiter Thermal Protection System undensified tiles under mission dynamic loads

A description is provided of the results of a series of base driven random dynamic load tests of the Thermal Protection System (TPS). The results were used to insure the integrity of the undensified TPS prior to the first flight in the wing and mid-fuselage region. The number of specimens and the load ranges investigated were limited. Attention is given to the test specimens, the test procedure, a data analysis, and a discussion of the results. All specimens for both the wing and mid-fuselage regions survived an equivalent of 72 ascent missions and exhibited residual static strength greater than their original proof loads. These results indicate that the undensified tiles had sufficient strength to withstand ascent loads during the first flight.

Cooper, P. A.↗
NASA NTRS1981

Effect of load eccentricity and substructure deformation on ultimate strength of shuttle orbiter thermal protection system

The effect of load eccentricity and substructure deformation on the ultimate strength and stress displacement properties of the shuttle orbiter thermal protection system (TPS) was determined. The LI-900 Reusable Surface Insulation (RSI) tiles mounted on the .41 cm thick Strain Isolator Pad (SIP) were investigated. Substructure deformations reduce the ultimate strength of the SIP/tile TPS and increase the scatter in the ultimate strength data. Substructure deformations that occur unsymmetric to the tile can cause the tile to rotate when subjected to a uniform applied load. Load eccentricity reduces SIP/tile TPS ultimate strength and causes tile rotation.

Sawyer, J. W.↗
NASA NTRS1981

Room temperature shear properties of the strain isolator pad for the shuttle thermal protection system

Tests were conducted at room temperature to determine the shear properties of the strain isolator pad (SIP) material used in the thermal protection system of the space shuttle. Tests were conducted on both the .23 cm and .41 cm thick SIP material in the virgin state and after fifty fully reversed shear cycles. The shear stress displacement relationships are highly nonlinear, exhibit large hysteresis effects, are dependent on material orientation, and have a large low modulus region near the zero stress level where small changes in stress can result in large displacements. The values at the higher stress levels generally increase with normal and shear force load conditioning. Normal forces applied during the shear tests reduces the low modulus region for the material. Shear test techniques which restrict the normal movement of the material give erroneous stress displacement results. However, small normal forces do not significantly effect the shear modulus for a given shear stress. Poisson's ratio values for the material are within the range of values for many common materials. The values are not constant but vary as a function of the stress level and the previous stress history of the material. Ultimate shear strengths of the .23 cm thick SIP are significantly higher than those obtained for the .41 cm thick SIP.

Sawyer, J. W.↗
NASA NTRS1980

Fatigue properties of shuttle thermal protection system

Static and cyclic load tests were conducted to determine the static and fatigue strength of the RIS tile/SIP thermal protection system used on the orbiter of the space shuttle. The material systems investigated include the densified and undensified LI-900 tile system on the .40 cm thick SIP and the densified and undensified LI-2200 tile system on the .23 cm (.090 inch) thick SIP. The tests were conducted at room temperature with a fully reversed uniform cyclic loading at 1 Hertz. Cyclic loading causes a relatively large reduction in the stress level that each of the SIP/tile systems can withstand for a small number of cycles. For example, the average static strength of the .40 cm thick SIP/LI-900 tile system is reduced from 86 kPa to 62 kPa for a thousand cycles. Although the .23 cm thick SIP/LI-2200 tile system has a higher static strength, similar reductions in the fatigue strength are noted. Densifying the faying surface of the RSI tile changes the failure mode from the SIP/tile interface to the parent RSI or the SIP and thus greatly increases the static strength of the system. Fatigue failure for the densified tile system, however, occurs due to complete separation or excessive elongation of the SIP and the fatigue strength is only slightly greater than that for the undensified tile system.

Sawyer, J. W.↗
NASA NTRS1980

Room temperature mechanical properties of shuttle thermal protection system materials

Tests were conducted at room temperature to determine the mechanical properties and behavior of materials used for the thermal protection system of the space shuttle. The materials investigated include the LI-900 RSI tiles, the RTV-560 adhesive and the .41 cm (.16 thick) strain isolator pad (SIP). Tensile and compression cyclic loading tests were conducted on the SIP material and stress-strain curves obtained for various proof loads and load cyclic conditioning. Ultimate tensile and shear tests were conducted on the RSI, RTV, and SIP materials. The SIP material exhibits highly nonlinear stress-strain behavior, increased tangent modulus and ultimate tensile strength with increased loading rate, and large short time load relaxation and moderate creep behavior. Proof and cyclic load conditioning of the SIP results in permanent deformation of the material, hysteresis effects, and much higher tensile tangent modulus values at large strains.

Sawyer, J. W.↗
NASA NTRS1980

Analysis and test of bonded single lap joints with preformed adherends

A theoretical and experimental study has been conducted to investigate the load transfer of a single lap joint where the adherends have been preformed so that the angle between the line of action of the applied in-plane force and the bond line is reduced. The preforming of the adherend reduces the moment resultant in the adherend at the edge of the overlap region which reduces both the maximum peel and shear stresses in the adhesive, and gives a more uniform shear distribution in the adhesive. An increase in static load transfer of up to 120 percent has been shown, and several orders of magnitude increase in fatigue life have been achieved with modest preform angles. Thus, sizeable benefits can be obtained in the fatigue life or additional load capacity of bonded single lap joints by preforming the adherends.

Sawyer, J. W.↗
NASA NTRS1979

A critical examination of stresses in an elastic single lap joint

The results of an approximate nonlinear finite-element analysis of a single lap joint are presented and compared with the results of a linear finite-element analysis, and the geometric nonlinear effects caused by the load-path eccentricity on the adhesive stress distributions are determined. The results from finite-element, Goland-Reissner, and photoelastic analyses show that for a single lap joint the effect of the geometric nonlinear behavior of the joint has a sizable effect on the stresses in the adhesive. The Goland-Reissner analysis is sufficiently accurate in the prediction of stresses along the midsurface of the adhesive bond to be used for qualitative evaluation of the influence of geometric or material parametric variations. Detailed stress distributions in both the adherend and adhesive obtained from the finite-element analysis are presented to provide a basis for comparison with other solution techniques.

Cooper, P. A.↗