Engineering topics

Sharpe, William N., Jr.

Publications and source records attributed to Sharpe, William N., Jr..

5 records

NASA NTRS2007

Fracture Strength of Single-Crystal Silicon Carbide Microspecimens at Room and Elevated Temperature

Three shapes of tensile specimens were tested--curved with a very low stress concentration factor and straight with either a circular hole or an elliptical hole. The nominal thickness was 125 micron with a net section 100 micron wide; the overall length of these microspecimens was 3.1 mm. They were fabricated by an improved version of deep reactive ion etching, which produced specimens with smooth sidewalls and cross-sections having a slightly trapezoidal shape that was exaggerated inside the holes. The novel test setup used a vertical load train extending into a resistance furnace. The specimens had wedge-shaped ends which fit into ceramic grips. The fixed grip was mounted on a ceramic post, and the movable grip was connected to a load cell and actuator outside the furnace with a ceramic-encased nichrome wire. The same arrangement was used for tests at 24 and at 1000 C. The strengths of the curved specimens for two batches of material (made with slightly different processes) were 0.66+/-0.12 GPa and 0.45+/-0.20 GPa respectively at 24 C with identical values at 1000 C. The fracture strengths of the circular-hole and elliptical-hole specimens (computed from the stress concentration factors and measured loads at failure) were approximately 1.2 GPa with slight decreases at the higher temperature. Fractographic examinations showed failures initiating on the surface--primarily at corners. Weibull predictions of fracture strengths for the hole specimens based on the properties of the curved specimens were reasonably effective for the circular holes, but not for the elliptical holes.

Nemeth, Noel N.↗

NASA NTRS2007

Accounting for Uncertainties in Strengths of SiC MEMS Parts

A methodology has been devised for accounting for uncertainties in the strengths of silicon carbide structural components of microelectromechanical systems (MEMS). The methodology enables prediction of the probabilistic strengths of complexly shaped MEMS parts using data from tests of simple specimens. This methodology is intended to serve as a part of a rational basis for designing SiC MEMS, supplementing methodologies that have been borrowed from the art of designing macroscopic brittle material structures. The need for this or a similar methodology arises as a consequence of the fundamental nature of MEMS and the brittle silicon-based materials of which they are typically fabricated. When tested to fracture, MEMS and structural components thereof show wide part-to-part scatter in strength. The methodology involves the use of the Ceramics Analysis and Reliability Evaluation of Structures Life (CARES/Life) software in conjunction with the ANSYS Probabilistic Design System (PDS) software to simulate or predict the strength responses of brittle material components while simultaneously accounting for the effects of variability of geometrical features on the strength responses. As such, the methodology involves the use of an extended version of the ANSYS/CARES/PDS software system described in Probabilistic Prediction of Lifetimes of Ceramic Parts (LEW-17682-1/4-1), Software Tech Briefs supplement to NASA Tech Briefs, Vol. 30, No. 9 (September 2006), page 10. The ANSYS PDS software enables the ANSYS finite-element-analysis program to account for uncertainty in the design-and analysis process. The ANSYS PDS software accounts for uncertainty in material properties, dimensions, and loading by assigning probabilistic distributions to user-specified model parameters and performing simulations using various sampling techniques.

Nemeth, Noel↗

NASA NTRS2005

Fabrication and Probabilistic Fracture Strength Prediction of High-Aspect-Ratio Single Crystal Silicon Carbide Microspecimens With Stress Concentration

Single crystal silicon carbide micro-sized tensile specimens were fabricated with deep reactive ion etching (DRIE) in order to investigate the effect of stress concentration on the room-temperature fracture strength. The fracture strength was defined as the level of stress at the highest stressed location in the structure at the instant of specimen rupture. Specimens with an elliptical hole, a circular hole, and without a hole (and hence with no stress concentration) were made. The average fracture strength of specimens with a higher stress concentration was larger than the average fracture strength of specimens with a lower stress concentration. Average strength of elliptical-hole, circular-hole, and without-hole specimens was 1.53, 1.26, and 0.66 GPa, respectively. Significant scatter in strength was observed with the Weibull modulus ranging between 2 and 6. No fractographic examination was performed but it was assumed that the strength controlling flaws originated from etching grooves along the specimen side-walls. The increase of observed fracture strength with increasing stress concentration was compared to predictions made with the Weibull stress-integral formulation by using the NASA CARES/Life code. In the analysis isotropic material and fracture behavior was assumed - hence it was not a completely rigorous analysis. However, even with these assumptions good correlation was achieved for the circular-hole specimen data when using the specimen data without stress concentration as a baseline. Strength was over predicted for the elliptical-hole specimen data. Significant specimen-to-specimen dimensional variation existed in the elliptical-hole specimens due to variations in the nickel mask used in the etching. To simulate the additional effect of the dimensional variability on the probabilistic strength response for the single crystal specimens the ANSYS Probabilistic Design System (PDS) was used with CARES/Life.

Nemeth, Noel N.↗

NASA NTRS1989

An interferometric strain-displacement measurement system

A system for measuring the relative in-plane displacement over a gage length as short as 100 micrometers is described. Two closely spaced indentations are placed in a reflective specimen surface with a Vickers microhardness tester. Interference fringes are generated when they are illuminated with a He-Ne laser. As the distance between the indentations expands or contracts with applied load, the fringes move. This motion is monitored with a minicomputer-controlled system using linear diode arrays as sensors. Characteristics of the system are: (1) gage length ranging from 50 to 500 micrometers, but 100 micrometers is typical; (2) least-count resolution of approximately 0.0025 micrometer; and (3) sampling rate of 13 points per second. In addition, the measurement technique is non-contacting and non-reinforcing. It is useful for strain measurements over small gage lengths and for crack opening displacement measurements near crack tips. This report is a detailed description of a new system recently installed in the Mechanisms of Materials Branch at the NASA Langley Research Center. The intent is to enable a prospective user to evaluate the applicability of the system to a particular problem and assemble one if needed.

Sharpe, William N., Jr.↗

NASA NTRS1988

Closure measurements on short fatigue cracks

Single-edged notched specimens, 2.3 mm thick, of 2024-T3 aluminum were cyclically loaded at R-ratios of 0.5, 0.0, -1.0, and -2.0. The notch roots were periodically inspected with an optical microscope to locate the initiation of very short cracks. Acetate replicas were also taken. The loads were selected to produce fatigue lives of 500,000 cycles or less. Crack opening displacements were measured at single positions across cracks as short as 0.035 mm and as long as the full thickness of the specimen. The opening load ratios for the short cracks are somewhat smaller than for long cracks at positive R-ratios, but are considerably smaller for negative R-ratios.

Lee, Joo-Jin↗