Engineering topics

Shenai, Alpana

Publications and source records attributed to Shenai, Alpana.

3 records

DOE OSTI2024

First test results of the HGCAL concentrator ASICs: ECON-T and ECON-D

With over 6 million channels, the High Granularity Calorimeter for the CMS HL-LHC upgrade presents a unique data transmission challenge. The ECON ASICs provide a critical stage of on-detector data compression and selection for the trigger path (ECON-T) and data acquisition path (ECON-D) of the HGCAL. The ASICs, fabricated in 65 nm CMOS, are radiation tolerant up to 200 Mrad and require low power consumption: < 2.5 mW/sensor-channel per chip. Here, we report on the first functionality and radiation tests for the ECON-D-P1 full-functionality prototype. We present a comparison of single event effect (SEE) cross sections measured for different methods of triple modular redundancy using test results from the ECON-T-P1 full-functionality prototype.

47 OTHER INSTRUMENTATION↗

DOE OSTI2023

CMS High Granularity Calorimeter ECON-D ASIC overview and radiation testing results

The Compact Muon Solenoid (CMS) Experiment’s High Granularity Calorimeter (HGCAL) upgrade replaces the CMS electromagnetic and hadronic endcap calorimeters in preparation for the high-rate and high-radiation environment of the High Luminosity LHC. To effectively use the over 6 million channels of this highly-segmented “imaging” calorimeter, CMS is pioneering very front-end data compression with the Endcap Concentrator (ECON) ASICs – the ECON-T for the trigger path and the ECON-D for the data path. These 65 nm CMOS ASICs are radiation tolerant (200 Mrad) and low-power (< 2.5 mW/channel). In June 2023, we received the first full-functionality prototype of the data path concentrator ASIC, the ECON-D-P1. This talk will present an overview of the ECON-D-P1, summarize functionality and system testing, and present results from both Total Ionizing Dose (TID) and Single Event Effect (SEE) testing campaigns completed in summer 2023, validating the ECON-D radiation tolerant performance.

72 PHYSICS OF ELEMENTARY PARTICLES AND FIELDS↗

DOE OSTI2017

Vertically Integrated Edgeless Photon Imaging Camera

The Vertically Integrated Photon Imaging Chip - Large, (VIPIC-L), is a large area, small pixel (65μm), 3D integrated, photon counting ASIC with zero-suppressed or full frame dead-time-less data readout. It features data throughput of 14.4 Gbps per chip with a full frame readout speed of 56kframes/s in the imaging mode. VIPIC-L contain 192 x 192 pixel array and the total size of the chip is 1.248cm x 1.248cm with only a 5μm periphery. It contains about 120M transistors. A 1.3M pixel camera module will be developed by arranging a 6 x 6 array of 3D VIPIC-L’s bonded to a large area silicon sensor on the analog side and to a readout board on the digital side. The readout board hosts a bank of FPGA’s, one per VIPIC-L to allow processing of up to 0.7 Tbps of raw data produced by the camera.

Fahim, Farah↗