DOE OSTI · 1412507
Vertically Integrated Edgeless Photon Imaging Camera
Abstract
The Vertically Integrated Photon Imaging Chip - Large, (VIPIC-L), is a large area, small pixel (65μm), 3D integrated, photon counting ASIC with zero-suppressed or full frame dead-time-less data readout. It features data throughput of 14.4 Gbps per chip with a full frame readout speed of 56kframes/s in the imaging mode. VIPIC-L contain 192 x 192 pixel array and the total size of the chip is 1.248cm x 1.248cm with only a 5μm periphery. It contains about 120M transistors. A 1.3M pixel camera module will be developed by arranging a 6 x 6 array of 3D VIPIC-L’s bonded to a large area silicon sensor on the analog side and to a readout board on the digital side. The readout board hosts a bank of FPGA’s, one per VIPIC-L to allow processing of up to 0.7 Tbps of raw data produced by the camera.
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Fahim, Farah, Deptuch, Grzegorz, Shenai, Alpana, Maj, Piotr, Kmon, Piotr, Grybos, Pawel, Szczygiel, Robert, Siddons, D. Peter, Rumaiz, Abdul, Kuczewski, Anthony, Mead, Joseph, Bradford, Rebecca, Weizeorick, John. 2017-01-01. Vertically Integrated Edgeless Photon Imaging Camera. https://www.osti.gov/biblio/1412507
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