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Springer, Martin

Publications and source records attributed to Springer, Martin.

25 records · Page 2
All sourcesNASA NTRSDOE OSTI
DOE OSTI2020

Improving Computational Efficiency of Mechanical Finite Element Method Simulations for PV Modules: Preprint

In this work we have elucidated the trade off between structural mechanics FEM model accuracy and computation time by employing lower fidelity viscoelastic models. Results indicate that computation time can easily be cut in half while only expecting a potential maximum error of 10 % by considering lower fidelity models. A novel approach to produce the Prony Series fit for viscoelastic characterization has also been presented. Employing this approach, we were able to achieve a further 10 % reduction in computation time without further sacrificing simulation accuracy.

41 EE - Solar Energy Technologies Office (EE-4S)↗
DOE OSTI2020

Environmental influence on cracking and debonding of electrically conductive adhesives

Electrically conductive adhesives (ECAs) are starting to replace metallic solders in recent designs of photovoltaic (PV) modules. This transition represents a significant material change, and a proper understanding of the durability and reliability of the new interconnect needs to be established. This paper presents our continued work on developing a degradation model for ECA interconnects in PV modules. Here, we characterize the fracture mechanics properties of an epoxy-based ECA, for both critical and subcritical, mode I and mode II loading conditions. Emphasis is on the influence of different environmental conditions such as temperature and humidity. We use the Finite Element Method to account for residual stresses, induced by temperature changes and moisture absorption, and correct the apparent fracture toughness. We found that high moisture levels not only can weaken the fracture resistance of the ECA interconnect, but can also promote subcritical debonding at significantly lower driving forces than in dry environments.

42 ENGINEERING↗
DOE OSTI2020

Investigation of Failure Modes, Mechanisms and Driving Forces for Electrically Conductive Adhesives as Interconnects in PV Modules

In this work we describe our current progress into investigating the reliability of ECA interconnects for PV modules. Preliminary thermal cycling experiments demonstrated that both cohesive and adhesive failure of the ECA joint are relevant failure modes that result in an increase of the joints electrical resistance. A thorough viscoelastic characterization of the candidate ECA was conducted to enable accurate numerical modeling of the joint’s response to thermal cycling. Combined with critical and subcritical fracture measurements, the numerical model elucidates that an additional fatigue mechanism exists which can result in fracture well below subcritical debonding threshold values. It is also demonstrated that fracture of the ECA is more sensitive to humidity than temperature and subcritical debonding mechanisms do exist which are again more sensitive to humidity.

41 EE - Solar Energy Technologies Office (EE-4S)↗
DOE OSTI2020

Viscoelastic Material Characterization and Modeling of Photovoltaic Module Packaging Materials for Direct Finite-Element Method Input

Numerical tools, such as the finite-element method, are increasingly used to design and evaluate the photovoltaic (PV) modules, providing for the reduction of development time and improved performance and reliability. However, high-fidelity material models are necessary to accurately model the complex structural behavior of the involved packaging materials. A common simplification used in recent years is to model the polymer materials (i.e., encapsulant and backsheet) as linear elastic, which will lead to inaccurate results. Therefore, in this work, we present a thorough characterization of the time- and temperature-dependent mechanical response of predominant PV module encapsulant and backsheet materials. Based on this material characterization, we developed and experimentally validated generalized Maxwell models to describe each material's viscoelastic response. In addition, we included measurements of the coefficient of thermal expansion and presented all material models in such a fashion for direct input into commercial finite-element method modeling software.

FEM↗
DOE OSTI2020

Linear viscoelastic characterization of electrically conductive adhesives used as interconnect in photovoltaic modules

Electrically conductive adhesives (ECAs) are incorporated into recent designs of photovoltaic (PV) modules and replace the traditional metallic solders as interconnects. This transition depicts a significant material change, and a proper understanding of the interconnects' mechanical response has not yet been established. However, such an understanding is necessary to (a) identify the driving forces for module degradation and failure, (b) allow for module design optimization, and (c) enable accurate lifetime predictions. This study summarizes the framework for the mechanical materials characterization and modeling of ECAs for PV applications. Only high-fidelity material models are able to capture the rate and temperature dependency of the ECA interconnect and allow for accurate modeling of the materials response. Furthermore, a linear viscoelastic representation is found to describe the mechanical response of the ECAs sufficiently well. The effects of curing conditions and environmental exposure are investigated, and material models for a variety of ECAs are reported and prepared for the use in numerical simulations. Overall, a finite element simulation of a generic submodel of a shingled cell module is used to highlight the need for high-fidelity material models and demonstrates the error made in the predicted stress states by using less sophisticated models.

14 SOLAR ENERGY↗