Engineering topics
Publications and source records attributed to St.clair, A. K..
A process for improving the moisture resistance properties of epoxidized TGMDA and DGEBA resin system by chemically incorporating chromium ions is described. The addition of chromium ions is believed to prevent the absorption of water molecules.
A rubber-toughened, addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber-containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride has been mixed, and utilizing solvent or mixture of solvents for the reaction.
A series of essentially colorless aromatic polyimide films was synthesized and characterized with the objective of obtaining maximum optical transparency for applications in space. Optical transparency is a requirement for high performance polymeric films used in second surface mirror coatings on thermal control systems. The intensity in color of aromatic polyimide films was lowered by reducing the electronic interaction between chromophoric centers in the polymer molecular structure and by using highly purified monomers. The resulting lightly colored to colorless polyimide films were characterized by UV-visible and infrared spectroscopy before and after exposure to 300 equivalent solar hours UV irradiation and varying doses of 1 MeV electron irradiation. After irradiation, the films were found to be 2 to 2.5 times more transparent than commercial polyimide film of the same thickness.
A resin product useful as an adhesive, composite or casting resin is described as well as the process used in its preparation to improve its flexural strength mechanical property characteristics. Improved flexural strength is attained with little or no change in density, thermal stability or moisture resistance by chemically incorporating 1.2% to 10.6% by weight Co(3) ions in an epoxidized resin system.
Varying concentrations of an organometallic cobalt complex were added to an epoxy system currently used by the aerospace industry as a composite matrix resin. Methods for combining cobalt (III) acetylacetonate with a tetraglycidyl 4,4 prime - diaminodiphenylmethane-based epoxy were investigated. The effects of increasing cobalt ion concentration on the epoxy cure were demonstrated by epoxy gel times and differential scanning calorimetry cure exotherms. Analysis on cured cobalt-containing epoxy castings included determination of glass transition temperatures by thermomechanical analysis, thermooxidative stabilities by thermogravimetric analysis, and densities in a density gradient column. Flexural strength and stiffness were also measured on the neat resin castings.
A rubber-toughened addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state, and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride was mixed, and utilizing solvent or mixture of solvents for the reaction.
The incorporation of specific metal ions into polyimides is described. Detailed studies have included various compounds of copper, lithium, and palladium as dopants. Addition of the metal during polymerization or after formation of the polyamic acid precedes the thermal imidization step. With many dianhydride-diamine-dopant combinations high quality variously colored films are produced. Many metal doped films exhibit (1) improved high temperature adhesive properties, (2) increased electrical conductivity, (3) excellent thermal stability, (4) improved acid/base resistance, (5) increased modulus in flexible films and (6) excellent high temperature tensile strength. X-ray photo-electron spectroscopic study of these films suggests that many of the additives undergo chemical modification during thermal imidization. Palladium dopants appear to be partially reduced to the metallic state, while lithium and copper dopants are probably converted to their oxides. Ion etching experiments with Auger electron spectroscopy monitoring are discussed.
Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.
A variety of metallic and organometallic complexes to be used as potential additives for an epoxy used by the aerospace industry as a composite matrix resin were investigated. A total of 9 complexes were screened for compatibility and for their ability to accelerate or inhibit the cure of a highly crosslinkable epoxy resin. Methods for combining the metallic complexes with the resin were investigated, gel times recorded, and cure exotherms studied by differential scanning calorimetry. Glass transition temperatures of cured metal ion containing epoxy castings were determined by thermomechanical analysis. Thermal stabilities of the castings were determined by thermogravimetric analysis. Mechanical strength and stiffness of these doped epoxies were also measured.
A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.
Lightweight, high temperature resistant, electrically conductive, palladium containing polyimide films and methods for their preparation are described. A palladium (II) ion-containing polyamic acid solution is prepared by reacting an aromatic dianhydride with an equimolar quantity of a palladium II ion-containing salt or complex and the reactant product is cast as a thin film onto a surface and cured at approximately 300 C to produce a flexible electrically conductive cyclic palladium containing polyimide. The source of palladium ions is selected from the group of palladium II compounds consisting of LiPdCl4, PdS(CH3)2Cl2Na2PdCl4, and PdCl2. The films have application to aerodynamic and space structures and in particular to the relieving of space charging effects.
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in the presence of a water or lower alkanol miscible ether solvent to produce an intermediate polyamic acid. The polyamic acid is then converted to the thermally stable, metal ion-filled polyimide by heating in the temperature range of 300 C to produce a flexible, high temperature adhesive.
A series of polyimides containing silicone elastomers was synthesized in order to study the effects of the elastomer chain length on polymer properties. The elastomer with repeat units varying from n=10 to 105 was chemically reacted into the backbone of an addition polyimide oligomer via reactive aromatic amine groups. Glass transition temperatures of the elastomer and polyimide phases were observed by torsional braid analysis. The elastomer-modified polyimides were tested as adhesives for bonding titanium in order to determine their potential for aerospace applications. Adhesive lap shear tests were performed before and after aging bonded specimens at elevated temperatures.
The development of high temperature adhesives and polyphenylquinoxalines (PPQ) is reported. Thermoplastic polyimides and linear PPQ adhesive are shown to have potential for bonding both metals and composite structures. A nadic terminated addition polyimide adhesive, LARC-13, and an acetylene terminated phenylquinoxaline (ATPQ) were developed. Both of the addition type adhesives are shown to be more readily processable than linear materials but less thermooxidatively stable and more brittle. It is found that the addition type adhesives are able to perform, at elevated temperatures up to 595 C where linear systems fail thermoplastically.
Palladium addition makes light, flexible film with low resistivity to relieve space charging. Polyimide film is prepared in four steps: preparation of polyamic acid in polar solvent; addition of soluable palladium complex salt; fabrication of film of "palladium polyamic acid" solution; and thermal imidization of film to palladium-containing polyimide by 300 C heating. Lowered resistivities were achieved without loss in film flexibility or increase in film weight.
Adding complexed aluminum ions raises useful temperature of polyimide adhesive without embrittling it or reducing long term stability. Adhesives may be applied to prepared substrate surface without supports. Possible substrates are metal, composite, or polymeric film. Adhesive is excellent where bond flexibility is required.
Methods for crosslinking N-methyl substituted aromatic polyamides were investigated in an effort to improve the applicability of these polymers as matrix resins for Kavlar trademark fiber composites. High molecular weight polymers were prepared from isophthaloyl dichloride and 4,4'- bis(methylamino)diphenylmethane with varying proportions of the N,N'bispropargyl diamine incorporated as a crosslinking agent. The propargylcontaining diamines were crosslinked thermally and characterized by infrared spectroscopy, differential scanning calorimetry, and thermogravimetric analysis. Attempts were also made to crosslink polyamide films by exposure to ultraviolet light, electron beam, and gamma radiation.
An up to date review of available commercial and experimental high temperature polyimide resins which show potential for aerospace applications is presented. Current government research trends involving the use of polyimides as matrix resins for structural composites are discussed. Both the development of polyimides as adhesives for bonding metals and composites, and as films and coatings for use in an aerospace environment are reviewed. In addition, future trends for polyimides are proposed.