NASA NTRS · 19820025654
LARC-TPI: A multi-purpose thermoplastic polyimide
Abstract
A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.
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St.clair, A. K., St.clair, T. L.. 1982-06-01. LARC-TPI: A multi-purpose thermoplastic polyimide. https://ntrs.nasa.gov/citations/19820025654
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