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St.clair, T. L.

Publications and source records attributed to St.clair, T. L..

At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS1994

Preliminary evaluation of hybrid titanium composite laminates

In this study, the mechanical response of hybrid titanium composite laminates (HTCL) was evaluated at room and elevated temperatures. Also, the use of an elastic-plastic laminate analysis program for predicting the tensile response from constituent properties was verified. The improvement in mechanical properties achieved by the laminates was assessed by comparing the results of static strength and constant amplitude fatigue tests to those for monolithic titanium sheet. Two HTCL were fabricated with different fiber volume fractions, resin layer thicknesses, and resins. One panel was thicker and was more poorly bonded in comparison to other. Consequently, the former had a lower tensile strength, while fewer cracks grew in this panel and at a slower rate. Both panels showed an improvement in fatigue life of almost two orders of magnitude. The model predictions were also in good agreement with the experimental results for both HTCL panels.

Miller, J. L.↗
NASA NTRS1986

Effect of annealing history on free volume in thermoplastics

Two different types of thermoplastic glassy polymers have been investigated for the effects of thermal annealing on their free volumes. It has been observed that free volumes in glassy polymers decrease asymptotically to a steady level after about four thermal anneals lasting for 24 hours at a temperature about 50 C below their glass transition temperatures. These results indicate that composites incorporating properly annealed thermoplastic matrices may not experience any additional internal stresses due to subsequent thermal excursions experienced while in service.

Singh, J. J.↗
NASA NTRS1986

Poly (Carbonate-Mide) Polymer

A novel series of polymers and copolymers based on a polymide backbone with the incorporation of carbonate moieties along the backbone is presented. The preparation process for the polymers and copolymers is disclosed together with a novel series of dinitrodiphenyl carbonates and diaminodiphenyl carbonates. The novel polyners and copolymers exhibit high temperature capability and because of the carbonate unit, many exhibit a high degree of order and/or crystallinity.

St.clair, T. L.↗
NASA NTRS1985

Matrix resin development at NASA Langley Research Center

The polymer program at NASA Langley Research Center involves exploratory studies in polymer science. These include the synthesis of novel polymers and their characterization. Polymer synthesis programs involve the development of novel thermoplastics, pseudothermoplastics, and thermosets. Recent investigations have led to the development of more easily processable polyimides, solvent-resistant polysulfones and polyphenylquinoxalines, and tougher high and intermediate-temperature polymers. Characterization efforts have included high-pressure liquid chromatography methodology, the development of toughness tests for fiber-reinforced composites, a study of electrical properties of metal-ion-filled polyimides, and a study of the mutagenicity of aromatic diamines. Also the mechanism of cure/degradation of experimental polymers has been studied by rheology, mechanical behavior, separation techniques and spectroscopy. Some of these programs have involved the degradation crosslinking of alkyl-containing polyimides, the separation and identification of crosslinked phenylquinoxalines, the rheological behavior of hot-melt polyimides, and the elucidation of the cure of norbornene endcapped imides.

St.clair, T. L.↗
NASA NTRS1985

Synthesis and Characterization of Copolyimides with Varying Flexibilizing Groups

A series of polyimides and copolyimides with varying flexibilizing groups in their backbone were prepared. They were characterized in order to evaluate the effect of these groups on their rheological, mechanical, adhesive, and thermal properties. A copolymer with equimolar amounts of m-PDA and 4,4'-ODA exhibited the lowest viscosity at all strain rates studied. Since this particular polymer exhibited the best flow properties, it was also evaluated as an adhesive and was found to have exceptional characteristics for this application.

Burks, H. D.↗
NASA NTRS1985

STPI/LARC: A 200 deg C polyimide adhesive

A copolyimide, STPI/LARC, was prepared from the reaction of 3,3'4'benzophenonetetracarboxylic dianhydride (BTDA), equimolar quantities of m-phenylenediamine and 4,4'-oxydianiline, and a small amount of phthalic anhydride to control the molecular weight. The processability and adhesive properties of STPI/LARC were compared to those of a commercially available form of LARC-TPI. LARC-TPI, a thermoplastic polyimide, from the reaction of BTDA and 3,3'-diaminobenzophenone, had previously shown promise as a high temperature structural adhesive. Lap shear specimens were fabricated using adhesive tape prepared from each of the two polymers. Lap shear tests were performed at room temperature, 177 C, and 204 C before and after exposure to a 72-hour water-boil and to aging at 204 C.

Progar, D. J.↗
NASA NTRS1985

An investigation of molecular structure of copolymers using positron annihilation spectroscopy

Positron lifetime measurements were made in copolyimides synthesized from linear 4,4 prime-bis(3,4-dicarboxyphenoxy) diphenylsulfide dianhydride (BDSDA)/4,4 prime-diaminodiphenyl (ODA) and BDSDA/1,3-diaminobenzene (m-phenylene diamine) homopolymers. The probability of positronium formation as well as its subsequent lifetime are lower in the BDSDA/ODA/MPD (50-50) copolyimide, indicating the presence of a transition molecular architecture characterized by higher electron density and stronger bonds which permit both chemical as well as physical entry of water molecules into it. The presence of this transition region imparts unique physical and mechanical properties to the copolyimide.

Singh, J. J.↗
NASA NTRS1985

Elastomer toughened polyimide adhesives

A rubber-toughened, addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber-containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride has been mixed, and utilizing solvent or mixture of solvents for the reaction.

St.clair, A. K.↗
NASA NTRS1985

Evaluation of experimental epoxy monomers

Future generation aircraft need higher performance polymer matrices to fully achieve the weight savings possible with composite materials. New resins are being formulated in an effort to understand basic polymer behavior and to develop improved resins. Some polymer/curing agent combinations that could be useful are difficult to process. In the area of epoxies, a major problem is that some components have physical properties which make them difficult to utilize as matrix resins. A previous study showed that the use of ultrasonic energy can be advantageous in the mixing of curing agents into a standard epoxy resin, such as MY 720 (Ciba-Geigy designation). This work is expanded to include three novel epoxides.

Hodges, W. T.↗
NASA NTRS1984

Process for preparing solvent resistant, thermoplastic aromatic poly(imidesulfone)

A process for preparing a thermoplastic poly(midesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistant which is generally associated with polyimides but not polysulfones. This system is processable in the 250 to 350 C range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.

St.clair, T. L.↗
NASA NTRS1984

Hot melt adhesive attachment pad

A hot melt adhesive attachment pad for releasably securing distinct elements together is described which is particularly useful in the construction industry or a spatial vacuum environment. The attachment pad consists primarily of a cloth selectively impregnated with a charge of hot melt adhesive, a thermo-foil heater, and a thermo-cooler. These components are securely mounted in a mounting assembly. In operation, the operator activates the heating cycle transforming the hot melt adhesive to a substantially liquid state, positions the pad against the attachment surface, and activates the cooling cycle solidifying the adhesive and forming a strong, releasable bond.

Fox, R. L.↗
NASA NTRS1984

Thermoplastic/Melt-Processable Polyimides

Several polyimides were prepared which show promise for aircraft composite applications. This was achieved through a systematic polymer synthesis program where the glass transition temperatures were greatly lowered when compared to the older polyimide systems. Several of the materials were shown to be hot-melt processable and are attractive matrix resin candidates especially in light of their high g(sub Ic) values. At least two of these polyimides are available for evaluation and others are on the research horizon.

St.clair, T. L.↗
NASA NTRS1984

A study of the effects of end-cap molecular species on environmental characteristics of polimidesulfones

To improve the environmental stability and mechanical properties of polyimidesulfone (PISO2), it was decided to investigate the effects of various types of end caps on its thermo-mechanical and related properties. It was noted that end caps are effective in reducing the environmental damage susceptibility of PISO2 samples, apparently due to their ability to react with free end groups which are believed to be moisture pickup sites. Phthalic anydride, aniline and aminobenzophenone were the end caps used in this study.

Singh, J. J.↗
NASA NTRS1984

An investigation of chemically-induced improvement in saturation moisture characteristics of epoxies

MY-720/DDS epoxy samples were treated with three selected chemical compounds to render the active H-sites inactive for moisture absorption. Treating the epoxy castings with acetyl chloride and dichlorodimethyl silane leads only to surface changes indicating that these molecules are too large to penetrate the epoxy castings. Boron trifluoride, on the other hand, does penetrate the epoxy chain as is indicated by the formation of green domains in the interior of the castings. However, the process of saturating the specimens with moisture appears to leach out the chemical additives--thereby nullifying their possible ameliorative effects.

Singh, J. J.↗
NASA NTRS1984

Polyphenylene ethers with imide linking groups

Novel polyphenylene ethers with imide linking units are disclosed. These polymers incorporate the solvent and thermal resistance of polyimides and the processability of polyphenylene ethers. Improved physical properties over those of the prior art are obtained by incorporating meta linked ethers and/or polyphenylene oxides into the polymer backbone. A novel process for making polymers of this type is also disclosed. The process is unique in that the expected need of high process temperatures and/or special atmospheres are eliminated.

St.clair, T. L.↗
NASA NTRS1984

Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups

The compounds of the class of aromatic polyamides useful as matrix resins in the manufacture of composites or laminate fabrication were developed. The process for preparing this thermoplastic-thermoset polyamide system involves incorporating a latent crosslinking moiety along the backbone of the polyamide to improve the temperature range of fabrication thereof wherein the resin softens at a relatively low temperature (approx. 154 C) and subsequently sets-up or undergoes crosslinking when subjected to higher temperature (approx. 280 C).

St.clair, T. L.↗
NASA NTRS1983

Solvent resistant thermoplastic aromatic poly(imidesulfone) and process for preparing same

A process for preparing a thermoplastic poly(imidesulfone) is disclosed. This resulting material has thermoplastic properties which are generally associated with polysulfones but not polyimides, and solvent resistance which is generally associated with polyimides but not polysulfones. This system is processable in the 250 to 350 C range for molding, adhesive and laminating applications. This unique thermoplastic poly(imidesulfone) is obtained by incorporating an aromatic sulfone moiety into the backbone of an aromatic linear polyimide by dissolving a quantity of a 3,3',4,4'-benzophenonetetracarboxylic dianhydride (BTDA) in a solution of 3,3'-diaminodiphenylsulfone and bis(2-methoxyethyl)ether, precipitating the reactant product in water, filtering and drying the recovered poly(amide-acid sulfone) and converting it to the poly(imidesulfone) by heating.

St.clair, T. L.↗