Engineering topics
Publications and source records attributed to St.clair, T. L..
A composition and method are disclosed for increasing the use temperature of polyamides based on the incorporation of a latent crosslinking agent into the polymer backbone, wherein high temperature performance is achieved without sacrificing solubility or processability.
A rubber-toughened addition-type polyimide composition is disclosed which has excellent high temperature bonding characteristics in the fully cured state, and improved peel strength and adhesive fracture resistance physical property characteristics. The process for making the improved adhesive involves preparing the rubber containing amic acid prepolymer by chemically reacting an amine-terminated elastomer and an aromatic diamine with an aromatic dianhydride with which a reactive chain stopper anhydride was mixed, and utilizing solvent or mixture of solvents for the reaction.
Two similar polyimide systems were synthesized and characterized. The only structural difference was a sulfide linkage in the anhydride derived portion of the first system versus a sulfone linkage in the second. Their physical, mechanical, melt-flow and thermal properties were determined and also their resistance to some of the more common solvents. The flow properties of these polyimides indicate them to have potential for melt processability.
A new technique for mixing solid curing agents into liquid epoxy resins using ultrasonic energy was developed. This procedure allows standard curing agents such as 4,4 prime-diaminodiphenyl sulfone (4,4 prime-DDS) and its 3,3 prime-isomer, (3,3 prime-DDS) to be mixed without prior melting of the curing agent. It also allows curing agents such as 4,4 prime-diaminodiphenyl sulfone (4,4 prime-DDS) and its 3,3 prime-isomer, (3,3 prime-DDS) to be mixed without prior melting of the curing agent. It also allows curing agents with very high melt temperatures such as 4,4 prime-diaminobenzophenone (4,4 prime-DABP) (242 C) to be mixed without premature curing. Four aromatic diamines were ultrasonically blended into MY-720 epoxy resin. These were 4,4 prime-DDS; 3,3 prime-DDA; 4,4 prime-DABP and 3,3 prime-DABP. Unfilled moldings were cast and cured for each system and their physical and mechanical properties compared.
Few materials are available which can be used as aerospace adhesives at temperatures in the range of 300 C. The Materials Division at NASA-Langley Research Center developed several high temperature polyimide adhesives to fulfill the stringent needs of current aerospace programs. These adhesives are the result of a decade of basic research studies on the structure property relationships of both linear and addition aromatic polyimides. The development of both in house and commercially available polyimides is reviewed with regards to their potential for use as aerospace adhesives.
A polymer system has been prepared which has the excellent thermoplastic properties generally associated with polysulfones, and the solvent resistance and thermal stability of aromatic polyimides. This material, with improved processability over the base polyimide, can be processed in the 260-325 C range in such a manner as to yield high quality, tough unfilled moldings; strong, high-temperature-resistant adhesive bonds; and well consolidated, graphite-fiber-reinforced moldings (composities). The unfilled moldings have physical properties that are similar to aromatic polysulfones which demonstrates the potential as an engineering thermoplastic. The adhesive bonds exhibit excellent retention of initial strength levels even after thermal aging for 5000 hours at 232 C. The graphite-fiber-reinforced moldings have mechanical properties which makes this polymer attractive for the fabrication of structural composites.
A linear thermoplastic polyimide, LARC-TPI, was characterized and developed for a variety of high temperature applications. In its fully imidized form, this material can be used as an adhesive for bonding metals such as titanium, aluminum, copper, brass, and stainless steel. LARC-TPI was evaluated as a thermoplastic for bonding large pieces of polyimide film to produce flexible, 100 void-free laminates for flexible circuit applications. The development of LARC-TPI as a potential molding powder, composite matrix resin, high temperature film and fiber is also discussed.
A melt processable polyimide which contains sulfur and oxygen bridges between the aromatic rings (BDSDA/APB) was synthesized and characterized. Its physical, mechanical, thermal and flow properties were determined as was its resistance to some of the more commonly used solvents. The melt flow properties were measured for the temperature range 250 C - 350 C and under the conditions (stress/strain) encountered in commercial processes.
A meta-oriented aromatic diamine is reacted with an aromatic dianhydride and an aluminum compound in the presence of a water or lower alkanol miscible ether solvent to produce an intermediate polyamic acid. The polyamic acid is then converted to the thermally stable, metal ion-filled polyimide by heating in the temperature range of 300 C to produce a flexible, high temperature adhesive.
A series of polyimides containing silicone elastomers was synthesized in order to study the effects of the elastomer chain length on polymer properties. The elastomer with repeat units varying from n=10 to 105 was chemically reacted into the backbone of an addition polyimide oligomer via reactive aromatic amine groups. Glass transition temperatures of the elastomer and polyimide phases were observed by torsional braid analysis. The elastomer-modified polyimides were tested as adhesives for bonding titanium in order to determine their potential for aerospace applications. Adhesive lap shear tests were performed before and after aging bonded specimens at elevated temperatures.
An improvement of addition polyimides wherein an essentially solventless, high viscosity laminating resin is synthesized from low cost liquid monomers is disclosed. The improved process takes advantage of a reactive, liquid plasticizer such as monoethylphthalate (MEP) which is used in lieu of an alcohol solvent, and helps solve a major problem of maintaining good prepreg tack and drape, or the ability of the prepreg to adhere to adjacent plies and conform to a desired shape during the layup process. This improvement results in both longer life of the polymer prepreg and the processing of low void laminate and appears to be applicable to all addition polyimide systems.
The development of high temperature adhesives and polyphenylquinoxalines (PPQ) is reported. Thermoplastic polyimides and linear PPQ adhesive are shown to have potential for bonding both metals and composite structures. A nadic terminated addition polyimide adhesive, LARC-13, and an acetylene terminated phenylquinoxaline (ATPQ) were developed. Both of the addition type adhesives are shown to be more readily processable than linear materials but less thermooxidatively stable and more brittle. It is found that the addition type adhesives are able to perform, at elevated temperatures up to 595 C where linear systems fail thermoplastically.
An addition polyimide adhesive, LARC 13, was developed which shows promise for bonding both titanium and composites for applications which require service temperatures in excess of 533 K. The LARC 13 is based on an oligomeric bis nadimide containing a meta linked aromatic diamine. The adhesive melts prior to polymerization due to its oligomeric nature, thereby allowing it to be processed at 344 kPa or less. Therefore, LARC 13 is ideal for the bonding of honeycomb sandwich structures. After melting, the resin thermosets during the cure of the nadic endcaps to a highly crosslinked system. Few volatiles are evolved, thus allowing large enclosed structures to be bonded. Preparation of the adhesive as well as bonding, aging, and testing of lap shear and honeycomb samples are discussed.
Adding complexed aluminum ions raises useful temperature of polyimide adhesive without embrittling it or reducing long term stability. Adhesives may be applied to prepared substrate surface without supports. Possible substrates are metal, composite, or polymeric film. Adhesive is excellent where bond flexibility is required.
Adhesive development is directed towards elevated temperature applications (200-300 C). Because of thermal stability considerations, the most attractive adhesives for this temperature range are linear and addition polyimides. The linear polymide adhesive research encompassed basic structure-property relationships, solvent studies and formulations to meet various requirements. The most recent research in linear polyimide systems was in the development of thermoplastic systems in an effort to eliminate the undesirable evolution of water classically associated with the cure going through an amide-acid intermediate step in the cure process. Addition polyimide adhesive research was undertaken in order to avoid water evolution during cure. Basic structure-property relationships for these materials led to an adhesive which was used extensively for high temperature adhesive needs. Since addition systems are of a highly crosslinked nature, they are not as resistant to impact as their linear counterparts. In order to overcome this problem, research was done in the area of elastomer-toughening these polymers.
Methods for crosslinking N-methyl substituted aromatic polyamides were investigated in an effort to improve the applicability of these polymers as matrix resins for Kavlar trademark fiber composites. High molecular weight polymers were prepared from isophthaloyl dichloride and 4,4'- bis(methylamino)diphenylmethane with varying proportions of the N,N'bispropargyl diamine incorporated as a crosslinking agent. The propargylcontaining diamines were crosslinked thermally and characterized by infrared spectroscopy, differential scanning calorimetry, and thermogravimetric analysis. Attempts were also made to crosslink polyamide films by exposure to ultraviolet light, electron beam, and gamma radiation.
A novel addition polyimide based on the use of liquid monomers wherein the essentially solventless prepreg produced therefrom retains good drape, tack and other mechanical properties.
The characterization of addition polyimides with various end caps for adhesive applications at 120-250 C environments is discussed. Oligometric polyimides were prepared from 3,3',4,4'-benzophenone tetracarboxylic dianhydride and 3,3'-methylenedianiline which were end-capped with functionally reactive moities which cause crosslinking when the oligomers are heated to 200-400 C. The syntheses of the oligomers are outlined. The thermolysis of the oligomers was studied by differential scanning calorimetry and the resulting polymers were characterized by differential thermal analysis and adhesive performance. The adhesive data include lap shear strengths on titanium 6-4 adherends both before and after aging for 1000 hours at 121 C and/or 232 C.