Search NASA⌕ Search

Engineering topics

Tentzeris, Emmanouil M.

Publications and source records attributed to Tentzeris, Emmanouil M..

Multilayer electronic component systems and methods of manufacture

Multilayer electronic component systems and methods of manufacture are provided. In this regard, an exemplary system comprises a first layer of liquid crystal polymer (LCP), first electronic components supported by the first layer, and a second layer of LCP. The first layer is attached to the second layer by thermal bonds. Additionally, at least a portion of the first electronic components are located between the first layer and the second layer.

Thompson, Dane↗

Coupling Between CPW and Slotline Modes in Finite Ground CPW with Unequal Ground Plane Widths

The coupling between the desired CPW mode and the unwanted, slotline, mode is presented for finite ground coplanar waveguides with unequal ground plane widths. Measurements, quasi-static conformal mapping, and Method of Moment analysis are performed to determine the dependence of the slotline mode excitation on the physical dimensions of the FGC line and on the frequency range of operation. Introduction: Finite ground coplanar waveguide (FGC) is often used in low cost Monolithic Microwave Integrated Circuits (MMICs) because of its many advantages over microstrip and conventional CoPlanar Waveguide (CPW). It is uniplanar, which facilitates easy connection of series and shunt elements without via holes, supports a low loss, quasi-TEM mode over a wide frequency band, and since the ground planes are electrically and physically narrow, typically less than lambda/5 wide where lambda is the guided wavelength, they reduce the circuit size and the influence of higher order modes. However, they still support the parasitic slotline mode that plagues all CPW transmission lines.

Ponchak, George E.↗

Measured Propagation Characteristics of Finite Ground Coplanar Waveguide on Silicon with a Thick Polyimide Interface Layer

Measured propagation characteristics of Finite Ground Coplanar (FGC) waveguide on silicon substrates with resistivities spanning 3 orders of magnitude (0.1 to 15.5 Ohm cm) and a 20 micron thick polyimide interface layer is presented as a function of the FGC geometry. Results show that there is an optimum FGC geometry for minimum loss, and silicon with a resistivity of 0.1 Ohm cm has greater loss than substrates with higher and lower resistivity. Lastly, substrates with a resistivity of 10 Ohm cm or greater have acceptable loss.

Ponchak, George E.↗

Coupling Between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented.

Ponchak, George E.↗

Coupling Between Finite Ground Coplanar Waveguides Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/mm-wave integrated circuits on low resistivity Si wafers. However, the closely spaced transmission lines are susceptible to high levels of cross-coupling, which degrades the overall circuit performance. In this paper, theoretical and experimental results on coupling of Finite Ground Coplanar (FGC) waveguides embedded in polyimide layers are presented for the first time. These results show that FGC lines have approximately 8 dB lower coupling than coupled Coplanar Waveguides. Furthermore, it is shown that the forward and backward coupling characteristics for FGC lines do not resemble the coupling characteristics of other transmission lines such as microstrip.

Ponchak, George E.↗

Coupling Between Microstrip Lines with Finite Width Ground Plane Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing Si/SiGe monolithic microwave/millimeter-wave integrated circuits on complementary metal oxide semiconductor (CMOS) (low resistivity) Si wafers. Thin film microstrip lines (TFMS) with finite width ground planes embedded in the polyimide are often used. However, the closely spaced TFMS lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and experimental measurements are used to show that the ground planes must be connected by via holes to reduce coupling in both the forward and backward directions.

Ponchak, George E.↗

Coupling between Microstrip Lines Embedded in Polyimide Layers for 3D-MMICs on Si

Three-dimensional circuits built upon multiple layers of polyimide are required for constructing SilSiGe monolithic microwavdmillimeter-wave integrated circuits on CMOS (low resistivity) Si wafers. However, the closely spaced transmission lines are susceptible to high levels of coupling, which degrades circuit performance. In this paper, Finite Difference Time Domain (FDTD) analysis and measured characteristics of novel shielding structures that significantly reduce coupling between embedded microstrip lines are presented. A discussion of the electric and magnetic field distributions for the coupled microstrip lines is presented to provide a physical rationale for the presented results.

Ponchak, George E.↗

Finite Ground Coplanar (FGC) Waveguide: It's Characteristics and Advantages for Use in RF and Wireless Communication Circuits

To solve many of the problems encountered when using conventional coplanar waveguide (CPW) with its semi-infinite ground planes, a new version of coplanar waveguide with electrically narrow ground planes has been developed. This new transmission line which we call Finite Ground Coplanar (FGC) waveguide has several advantages which make it a better transmission line for RF and wireless circuits. Since the ground planes are electrically narrow, spurious resonances created by the CPW ground planes and the metal carrier or package base are eliminated. In addition, lumped and distributed circuit elements may now be integrated into the ground strips in the same way as they traditionally have been integrated into the center conductor to realize novel circuit layouts that are smaller and have less parasitic reactance. Lastly, FGC is shown to have lower coupling between adjacent transmission lines than conventional CPW.

Ponchak, George E.↗

Characterization of the Coupling Between Adjacent Finite Ground Coplanar (FGC) Waveguides

Coupling between adjacent Finite Ground Coplanar (FGC) waveguides as a function of the line geometry is presented for the first time. A two Dimension-Finite Difference Time Domain (2D-FDTD) analysis and measurements are used to show that the coupling decreases as the line to line separation and the grOUnd plane width increases. Furthermore, it is shown that for a given spacing between the center lines of two FGC lines, the coupling is lower if the ground plane width is smaller Lastly, electric field plots generated from the 2D-FDTD technique are presented which demonstrate a strong slotline mode is established in the coupled FGC line.

Ponchak, George E.↗

Characterization of Finite Ground Coplanar Waveguide with Narrow Ground Planes

Coplanar waveguide with finite width ground planes is characterized through measurements, conformal mapping, and the Finite Difference Time Domain (FDTD) technique for the purpose of determining the optimum ground plane width. The attenuation and effective permittivity of the lines are related to its geometry. It is found that the characteristics of the Finite Ground Coplanar line (FGC) are not dependent on the ground plane width if it is greater than twice the center conductor width, but less than lambda(sub d)/8. In addition, electromagnetic field plots are presented which show for the first time that electric fields in the plane of the substrate terminate on the outer edge of the ground plane, and that the magnitude of these fields is related to the ground plane width.

Ponchak, George E.↗