Engineering topics
Publications and source records attributed to Vonroos, O..
Mathematical models represent single-event upset in bipolar memory chips. Physics of single-event upset in integrated circuits discussed in theoretical paper. Pair of companion reports present mathematical models to predict critical charges for producing single-event upset in bipolar randomaccess memory (RAM) chips.
Electron-beam scanning method suggested for determining back-surface recombination velocity, SB, of back-surface-field (BSF) solar photovoltaic cell. Recombination velocity important because smaller value correlated with smaller saturation current and therefore higher cell efficiency. Method involves analyzing short-circuit current measured while electron beam scanned along edge of cell.
When an energetic particle (kinetic energy 0.5 MeV) originating from a radioactive decay or a cosmic ray transverse the active regions of semiconductor devices used in integrated circuit (IC) chips, it leaves along its track a high density electron hole plasma. The subsequent decay of this plasma by drift and diffusion leads to charge collection at the electrodes large enough in most cases to engender a false reading, hence the name single-event upset (SEU). The problem of SEU's is particularly severe within the harsh environment of Jupiter's radiation belts and constitutes therefore a matter of concern for the Galileo mission. The physics of an SEU event is analyzed in some detail. Owing to the predominance of nonlinear space charge effects and the fact that positive (holes) and negative (electrons) charges must be treated on an equal footing, analytical models for the ionized-charge collection and their corresponding currents as a function of time prove to be inadequate even in the simplest case of uniformly doped, abrupt p-n junctions in a one-dimensional geometry. The necessity for full-fledged computer simulation of the pertinent equations governing the electron-hole plasma therefore becomes imperative.
Electron beam probe technique estimate electron/hole capture cross sections in semiconductors with wide band gaps. Amplitude-modulated electron beam induces short-circuit current collected by ohmic contacts. Phase shift between this current and electron-beam current measured as function of frequency. Results of measurements used to ascertain recombination rates and energy levels.
Gas jet used to control shape of meniscus and thus to regulate ribbon thickness in vertical silicon-ribbon growth. Gas jet also cools ribbon, increasing maximum possible pull speed for silicon, contact angle of 11 degrees plus or minus 1 degree required for constant thickness ribbon growth. Cooling effect of gas jet increases maximum possible pull speed.
The gas and dust production rates of comets near the sun are intimately linked to the fate of the solar radiation as it is scattered and partially absorbed by the cometary dust envelope or halo surrounding the comet's nucleus. The radiation of nuclear matter (mostly water ice) and the release of dust particles embedded in the ice which are entrained by the escaping gas and subsequently form a dust atmosphere or halo. On the other hand, the interaction of the dust cloud with the solar radiation is in turn responsible for the amount of radiative energy received by the nucleus and thus determines the evaporation rate. It is shown that recent attempts to formulate this problem quantitatively are in error. The correct formulation is given and it is pointed out that negative extinction (enhancement of the primary radiation received by the nucleus due to multiple scattering) may not be as large as predicted.
Report describes simple concise theory of back-surface-field (BSF) solar cells (npp + junctions) based on Shockley's depletion-layer approximation and cites superiority of two-junction devices over conventional unijunction cells.
A standard procedure for the determination of the minority carrier diffusion length by means of a scanning electron microscope (SEM) consists in scanning across an angle-lapped surface of a P-N junction and measuring the resultant short circuit current I sub sc as a function of beam position. A detailed analysis of the I sub sc originating from this configuration is presented. It is found that, for a point source excitation, the I sub sc depends very simply on x, the variable distance between the surface and the junction edge. The expression for the I sub sc of a planar junction device is well known. If d, the constant distance between the plane of the surface of the semiconductor and the junction edge in the expression for the I of a planar junction is merely replaced by x, the variable distance of the corresponding angle-lapped junction, an expression results which is correct to within a small fraction of a percent as long as the angle between the surfaces, 2 theta sub 1, is smaller than 10 deg.