NASA NTRS · 19700000148
A new low-expansion nonflammable printed circuit board
Abstract
Printed circuit board has a thermal coefficient of expansion similar to that of the electronic component leads. High-expansion composite materials are sandwiched between the outer layers of copper and woven fiber glass.
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Kennedy, B. W.. 1970-05-01. A new low-expansion nonflammable printed circuit board. https://ntrs.nasa.gov/citations/19700000148
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