NASA NTRS · 19710028040
Evaluation of nondestructive tensile testing
Abstract
Evaluation of nondestructive tensile testing of chip and wire bonds in semiconductor devices
Keep this discovery
Explore connections, maps & timelines
Polcari, S. M., Bowe, J. J.. 1971-06-01. Evaluation of nondestructive tensile testing. https://ntrs.nasa.gov/citations/19710028040
Cite the original work for its findings. Save a collection to share your selection of sources.