Evaluation of nondestructive tensile testing
Evaluation of nondestructive tensile testing of chip and wire bonds in semiconductor devices
Polcari, S. M.↗
Engineering topics
Polcari, S. M.
Publications and source records attributed to Polcari, S. M..
Evaluation of nondestructive tensile testing
The results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds are presented. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations.
Bowe, J. J.↗
Some practical aspects of scribing
Diamond scribing methods of separating semiconductor devices on silicon wafers
Polcari, S. M.↗
Spherical drilling - A new method for the measurement of junction depths in semiconductor devices.
Junction depths measurement in semiconductor devices by drilling with rotating sphere
Lagnado, I.↗