NASA NTRS · 19720005270
Evaluation of nondestructive tensile testing
Abstract
The results of a series of experiments performed in the evaluation of nondestructive tensile testing of chip and wire bonds are presented. Semiconductor devices were subjected to time-temperature excursions, static-load life testing and multiple pre-stressing loads to determine the feasibility of a nondestructive tensile testing approach. The report emphasizes the importance of the breaking angle in determining the ultimate tensile strength of a wire bond, a factor not generally recognized nor implemented in such determinations.
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Bowe, J. J., Polcari, S. M.. 1971-05-01. Evaluation of nondestructive tensile testing. https://ntrs.nasa.gov/citations/19720005270
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