NASA NTRS · 19720000328
Packaging concept for LSI beam lead integrated circuits
Abstract
Development of packaging system for mounting beam lead integrated chip circuit on lead frame is discussed. Process for fabricating large scale integration circuits is described. Diagrams illustrating method of construction are included.
Keep this discovery
Explore connections, maps & timelines
Kennedy, B. W.. 1972-07-01. Packaging concept for LSI beam lead integrated circuits. https://ntrs.nasa.gov/citations/19720000328
Cite the original work for its findings. Save a collection to share your selection of sources.