NASA NTRS · 19720061223
Diffusion bonded columbium panels for the shuttle heat shield.
Abstract
Work at North American Rockwell in the development of a satisfactory panel diffusion bonding method for Nb shuttle orbiter heat shield panel designs is reviewed. The topics include the diffusion bonding process, panel fabrication and quality control. A practicable Nb alloy diffusion bonding method, using a Ti foil interleaf, is described and is characterized as one providing a production basis at competitive cost.
Keep this discovery
Explore connections, maps & timelines
Korb, L. J., Beuyukian, C. S., Rowe, J.. 1972-07-01. Diffusion bonded columbium panels for the shuttle heat shield.. https://ntrs.nasa.gov/citations/19720061223
Cite the original work for its findings. Save a collection to share your selection of sources.