Heat pipe thermal conditioning panel

Abstract

Thermal control of electronic hardware and experiments on future space vehicles is critical to proper functioning and long life. Thermal conditioning panels (cold plates) are a baseline control technique in current conceptual studies. Heat generating components mounted on the panels are typically cooled by fluid flowing through integral channels within the panel. However, replacing the pumped fluid coolant loop within the panel with heat pipes offers attractive advantages in weight, reliability, and installation. This report describes the development and fabrication of two large 0.76 x 0.76 m heat pipe thermal conditioning panels to verify performance and establish the design concept.