NASA NTRS · 19750000219
Open coil structure for bubble-memory-device packaging
Abstract
Concept has several important advantages over close-wound system: memory and coil chips are separate and interchangeable; interconnections in coil level are eliminated by packing memory chip and electronics in single structure; and coil size can be adjusted to optimum value in terms of power dissipation and field uniformity.
Keep this discovery
Explore connections, maps & timelines
Chen, T. T., Ypma, J. E.. 1975-10-01. Open coil structure for bubble-memory-device packaging. https://ntrs.nasa.gov/citations/19750000219
Cite the original work for its findings. Save a collection to share your selection of sources.