NASA NTRS · 19750011612
Multitarget sequential sputtering apparatus
Abstract
The development and characteristics of a sputtering apparatus are discussed. A potential difference is applied between the cathode and anode to produce a plasma for each target which is sputtered by accelerated ions within the plasma. The process of sputtering for various materials is described. Diagrams of the unit are provided.
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Shima, R.. 1975-02-04. Multitarget sequential sputtering apparatus. https://ntrs.nasa.gov/citations/19750011612
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