NASA NTRS · 19760004768
Testing of printed circuit board solder joints by optical correlation
Abstract
An optical correlation technique for the nondestructive evaluation of printed circuit board solder joints was evaluated. Reliable indications of induced stress levels in solder joint lead wires are achievable. Definite relations between the inherent strength of a solder joint, with its associated ability to survive stress, are demonstrable.
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Espy, P. N.. 1975-11-01. Testing of printed circuit board solder joints by optical correlation. https://ntrs.nasa.gov/citations/19760004768
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