Evaluation of a low-density polyimide foam in a dynamic, high temperature environment

Abstract

A low density polyimide foam material was tested in an arc tunnel to determine its potential for heat shield application on aerospace vehicles. The results show that the material has some reuse potential at surface temperatures as high as 750 K. When a black refractory paint was applied to the surface of the material, the surface recession was negligible at 750 K. An analytical thermal conductivity was derived for this material which, combined with measured thermal property values, can be used to make preliminary design thickness calculations for heat shield applications.