NASA NTRS · 19820000238
Etching Integrated Circuits
Abstract
20-page report reviews methods available for etching specific layers on wafers and discusses automation techniques and features on one particular automated system. Compares two major etching methods, chemical (wet) and plasma (dry), and discusses areas in need of development. Methods covered include "dip-and-dunk" manual method of chemical etching, automated chemical etching, and plasma etching.
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Kennedy, B. W.. 1983-03-01. Etching Integrated Circuits. https://ntrs.nasa.gov/citations/19820000238
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