NASA NTRS · 19850024124
Silicon ribbon stress-strain activities
Abstract
The finite element method is used to investigate stress/strain in silicon ribbon. Failure considerations such as residual stress, buckling material non-linearity and creep are discussed. Temperature profiles are presented.
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Wada, B. K., Shih, C. F., Kuo, C. P., Phillips, W. M.. 1984-10-01. Silicon ribbon stress-strain activities. https://ntrs.nasa.gov/citations/19850024124
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