NASA NTRS · 19860000008
Ultrasonic Bonding to Metalized Plastic
Abstract
New technique makes it possible to bond wires ultrasonically to conductor patterns on such soft substrates as plain or ceramic-filled polytetrafluoroethylene. With ultrasonic bonding, unpackaged chips attached to soft circuit boards. Preferred because chips require substrate area and better matched electrically to circuit board at high frequencies.
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Conroy, B. L., Cruzan, C. T.. 1986-06-01. Ultrasonic Bonding to Metalized Plastic. https://ntrs.nasa.gov/citations/19860000008
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