NASA NTRS · 19920027627
Vacuum bag bonding with a high temperature adhesive
Abstract
A novel controlled molecular weight form of LARC-TPI polymide that exhibits an exceptionally high degree of melt flow in the 340-360 C temperature range has been developed. This material has been evaluated as a high-temperature adhesive, and because of its flow, cost-effective vacuum bag/oven processing can be used. Comparison of adhesive performance with higher molecular weight forms bonded at higher pressures shows this novel material to be equal in mechanical strength.
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Progar, Donald J., St. Clair, Terry L.. 1991-01-01. Vacuum bag bonding with a high temperature adhesive. https://ntrs.nasa.gov/citations/19920027627
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