Accelerated thermal and mechanical testing of CSP assemblies

Abstract

Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.