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Ghaffarian, R.

Publications and source records attributed to Ghaffarian, R..

At least 19 records
All sourcesNASA NTRSDOE OSTI
NASA NTRS2003

Visual and x-ray inspection characteristics of eutectic and lead free assemblies

For high reliability applications, visual inspection has been the key technique for most conventional electronic package assemblies. Now, the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic array packages such as ball grid array (BGAs) and chip scale packages (CSPs).

x-ray↗
NASA NTRS2002

SIP qualification and PRA approaches

System in a package (SIP) development is a response to an increasing demand for integration of different functions into one unit to reduce size and cost and improve functionality. Qualification of the newly developed multifunctional electronics are becoming complex at the package level and even more at the second and system levels.

probability risk assessment weibull lognormal ball↗
NASA NTRS2001

Effect of thermal cycling ramp rate on CSP assembly reliability

A JPL-led chip scale package consortium of enterprises recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages for a variety of projects. The experience of the consortium in building more than 150 test vehicle assemblies, single and double sided multilayer PWBs, and the environmental test results has now been published as a chip scale package guidelines document.

accelerated thermal cycle chip scale package solde↗
NASA NTRS2000

Accelerated thermal and mechanical testing of CSP assemblies

Chip Scale Packages (CSP) are now widely used for many electronic applications including portable and telecommunication products. A test vehicle (TV-1) with eleven package types and pitches was built and tested by the JPL MicrotypeBGA Consortium during 1997 to 1999. Lessons learned by the team were published as a guidelines document for industry use. The finer pitch CSP packages which recently became available were indluded in the next test vehicle of the JPL CSP Consortium.

Chip Scale Package CSP thermal cycle fatigue solde↗
NASA NTRS2000

Comparison of IC and MEMS packaging reliability approaches

This paper reviews the current status of IC and MEMS packaging technology with emphasis on reliability, compares the norm for IC packaging reliability evaluation and identifies challenges for development of reliability methodologies for MEMS, and finally, proposes the use of COTS MEMS in order to start generating statistically meaningful reliability data as a vehicle for future standardization of reliability test methodology for MEMS packaging.

microelectromechanical systems (MEMS) chip scale p↗