Interconnection and packaging isses of microelectromechanical systems (MEMS) and COTS MEMS
MEMS quality and reliability challenges are discussed and needs for study in these areas are identified.
MEMS packaging interconnection failure mechanisms↗
Engineering topics
Ghaffarian, R.
Publications and source records attributed to Ghaffarian, R..
Impact of print parameters and CSP pitch and I/O on paste quality and volume
This paper presents the effects of paste printing parameters including stencil thickness, squeegee length and materials, and pressurized head on solder paste volume.
SMT BGA chip scale package CSP assembly aspect rat↗
Thermal cycling test results of CSP and RF assemblies
A JPL-led chip scale package (CSP) Consortium of enterprises, composed of representing agencies and private companies, recently joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP thermal cycle solder joint ↗
Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
COTS MEMS packaging interconnections reliability↗
MEMS Packaging and Reliability Challenges
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microelectromechanical systems MEMS COTS reliabili↗
Effect of Underfill on CSP Assembly Reliability
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effect underfill CSP assembly reliability↗
CSP Assembly Reliability and Effects of Underfill and Double-Sided Population
The JPL-led MicrotypeBGA Consortium of enterprises representing government agencies and private companies have jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP solder joint reliability un↗
Chip Scale Package Issues
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
solder↗
Impact of CSP Assembly Underfill on Reliability
This paper reviews the package trend towards miniature scale package (CSP).
chip scale package underfill solderjoint reliabili↗
Commercial-Off-The-Shelf Microelectromechanical Systems
Research and development of microelectromechanical systems (MEMS) has shown a significant promise for a variety of commercial applications.
COTS MEMS sensor reliability failure mechanisms↗
Manufacturing Robustness of CSP in SMT Line
In this paper, the assembly process flow, solder paste for different stencil design, manufacturing defects, X-ray inspection results, and ultrasonic characterizations are reported.
electronic assembly SMT CSP fine pitch microvia te↗
CSP Reliability for Single-and Double-Sided Assemblies
This paper reviews the package trend towards further miniaturization of emerging chip scale package (CSP).
CSP chip scale package thermal cycle solder joint ↗
CSP Assembly Reliability: Commercial and Harsh Environments
The JPL-led CSP Consortium of enterprises representing government agencies and private companies has jointed together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
chip scale package CSP Solder Joint Reliability Th↗
Reliability Assessment of COTS MEMS Components for Aerospace Environment
Research and development of Micro-Electro-Mechanical Systems (MEMS) in the last decade has shown a significant promise for a variety of commercial applications including automobile and medical purposes.
Aerospace Environment MEMS sensors COTS reliabilit↗
Review of Stack CSP Technologies
CSP is an emerging technology with significant potential growth in stacking. Many of the stacking techniques for conventional packages could be implemented for CSP once materials, process, and system development for finer features are developed.
3D CSP stack CSP Chip Scale Package MCM Mulitchip ↗
CSP Assembly Reliability
Reviews the many factors that affect interconnect reliability of emerging chip scale package (CSP) assemblies. These include: package type, package build, board design, and assembly variables.
chip scale package CSP solder joint reliability th↗
NEPP Cots Mems Programs
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COTS Microelectromechanical Systems MEMS reliabili↗
Accelerated Thermal Cycling and Failure Mechanisms
This paper reviews the accelerated thermal cycling test methods that are currently used by industry to characterize the interconnect reliability of commercial-off-the-shelf (COTS) ball grid array (BGA) and chip scale package (CSP) assemblies.
BGA CSP CBGA thermal cycle solder joint reliabilit↗