NASA NTRS · 20060032340
Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS)
Abstract
Integrated circuit packaging and their testing is well advanced because of the maturity of the IC industry, their wide applications, and availability of industrial infrastructure.
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Rameshan, R., Ghaffarian, R.. 2000-05-22. Challenges in Interconnection and Packaging of Microelectromechanical Systems (MEMS). https://ntrs.nasa.gov/citations/20060032340
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