NASA NTRS ยท 20060034525
Impact of CSP Assembly Underfill on Reliability
Abstract
This paper reviews the package trend towards miniature scale package (CSP).
Explore related subjects
Keep this discovery
Explore connections, maps & timelines
Ghaffarian, R.. 2000-03-14. Impact of CSP Assembly Underfill on Reliability. https://ntrs.nasa.gov/citations/20060034525
Cite the original work for its findings. Save a collection to share your selection of sources.