Engineering topics
Ghaffarian, R.
Publications and source records attributed to Ghaffarian, R..
Chip Scale Package Implementation Challenges
The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.
SM Package Miniaturization Trends and Assembly Reliability Challenges
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
Chip Scale Package Integrity Assessment by Isothermal Aging
Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.
Shock and Thermal Cycling Synergism Effects on Reliability of CBGA Assemblies
Ball Grid Arrays (BGAs) are now packages of choice especially for higher I/O counts for commercial applications and are also being considered for use in military and aerospace.
A Systems Approach for Quality and Reliability of Chip Scale Package Assembly
This paper reviews many factors that affect interconnect reliability of commercial-off-the-shelf (COSTS) chip scale package (CSP) assemblies.
Assembly Reliability of BGAs and Effects of Board Finish
This paper will present failure characteristics of the assemblies up to 7,000 cycles.
Chip Scale Package and Assembly Joint Reliability
The popularity of emerging miniaturized Chip Scale Packages (CSPs) is rapidly growing because of their benefits and smaller size.
Assessment of Strengths & Weaknesses for Major IC Packages
Explore the source record for details and available documents.
Chip Scale Package Implementation Issues
Availability of board solder joint reliability information is critical to the wider implementation of Chip Scale Packages (CSPs).
3D Chip Scale Package (CSP)
Package/die stacking technology enhances most aspects of electronic systems such as size, weight, speed, yield, and power consumption.
Reliability Issues of COTS MEMS for Aerospace Applications
This paper reviews the current status of MEMS packaging technology from COTS to specific application provides lessons learned, and finally, identifies a need for systematic approach for this purpose.
CSP Assembly Reliability Challenges
This paper will compare three different CSP concepts as well as their assembly reliability.
A Review of Chip Scale and Ball Grid Array Assembly Reliability
Explore the source record for details and available documents.
CSP Consortia Activies: Program Objectives and Status
The paper will provide an overview and independent articles provided by team members.
Effects of Board Surface Finish on Failure Mechanisms and Reliability of BGAs
This paper will present cycles to failure in Weibull plots as well as their failure characteristics up to 7000 cycles.
Key Factors on CSP Assembly Reliability
Although the weakest link of CSP assembly reliability has been often internal package failure, solder joint fatigue is still considered to be the key factor for reliability.
Reliability and Failure Analyses of Thermally Cycled Ball Grid Array Assemblies
Reliability of Ball Grid Arrays was assessed as part of a consortium effort led by the Jet Propulsion Laboratory.