NASA NTRS · 20210002685
Chip Scale Package Integrity Assessment by Isothermal Aging
Abstract
Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.
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Ghaffarian, R.. 1999-04-07. Chip Scale Package Integrity Assessment by Isothermal Aging. https://ntrs.nasa.gov/citations/20210002685
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