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NASA NTRS · 20210002718

Chip Scale Package Implementation Challenges

Ghaffarian, R.
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Abstract

The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

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chipscalepackageCSPisothermalagingthermalcyclingsolderjointreliabilityBGAshearforce

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BibTeXRIS

Ghaffarian, R.. 1999-06-01. Chip Scale Package Implementation Challenges. https://ntrs.nasa.gov/citations/20210002718

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