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Search indexed NASA NTRS and DOE OSTI research on propulsion, heat transfer, battery materials and energy systems. Follow report and document links to the original sources.

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At least 19 records
All sourcesNASA NTRSDOE OSTI
DOE OSTI2019

Solderability of AZ31B Magnesium Alloy Coated by Copper and Strength of the Solder Joints

Magnesium alloys are promising as light materials, while their high chemical reactivity makes them difficult to be soldered. In this study, the AZ31B alloy was pretreated by zincification and coated by an electrodeposited Cu layer, and then soldered with Sn-58Bi solder in air furnace. The microstructure and properties of the AZ31B/Cu(Zn)/SnBi solder joints were characterized to evaluate the solderability of the Cu-coated Mg alloy and the influence of soldering on the Cu coating. It was found that the Cu coating is dense, and little defect exists along the Cu(Zn)/AZ31B interface. The soldering process has little negative effect on the bonding between the Cu coating and the AZ31B substrate, and the AZ31B/Cu(Zn)/SnBi solder joints of high metallurgical quality were obtained. Tensile fracture of the solder joint occurs mainly in the solder, with no peeling of the Cu coating. Under shear loading, cracks initiate inside the SnBi solder and the final fracture of the joint occurs around the Cu{sub 6}Sn{sub 5}/solder interface or along the Cu(Zn)/AZ31B interface. The tensile and shear strength of the AZ31B/Cu(Zn)/SnBi solder joints are close to that of the SnBi/Cu solder joints. It is demonstrated that the Cu-coated Mg alloy shows superior solderability and can be soldered by the Sn-based low-melting solder in air.

36 MATERIALS SCIENCE↗
DOE OSTI2020

Evaluating MetGlasTM Solderability with Tin-Silver-Copper and Tin-Silver-Bismuth Solder Alloys

The solderability of MetGlas TM (subsidiary of Hitachi Metals, America Ltd) 2826 MB, a rapidly solidified metallic foil, was evaluated by the meniscus height/wetting force method for tin-silver-copper (SnAgCu) and tin-silver-bismuth (SnAgBi) solders to understand the effects of the extreme non-equilibrium condition of the MetglasTM surface on solderability performance. Of the variables studied here (solder temperature, heat treatment, and solder composition), solder composition had the largest impact on contact angle. Flux and foil composition remained constant throughout; but, these factors would also be predicted to significantly affect solderability. A greater understanding of the manner whereby non-equilibrium cooling affects solderability of these foils will broaden the application of soldering technology of structures fabricated by rapid cooling process (i.e. additively manufactured coatings and parts). Developing a robust database for Pb-free solderability behavior is also necessary, as industry transitions from tin-lead (SnPb) to lead free (Pb-free) solders.

36 MATERIALS SCIENCE↗
NASA NTRS2008

Solder Reflow Failures in Electronic Components During Manual Soldering

This viewgraph presentation reviews the solder reflow failures in electronic components that occur during manual soldering. It discusses the specifics of manual-soldering-induced failures in plastic devices with internal solder joints. The failure analysis turned up that molten solder had squeezed up to the die surface along the die molding compound interface, and the dice were not protected with glassivation allowing solder to short gate and source to the drain contact. The failure analysis concluded that the parts failed due to overheating during manual soldering.

Teverovsky, Alexander↗
DOE OSTI2021

Methods of fabricating vacuum housings with hermetic solder seals using capillary solder wicks

Hermetically sealed electronic devices and methods for fabricating the hermetically sealed electronic devices are provided. The devices include a solder sealed vacuum housing. The solder seal is formed using a solder wick having an external solder reservoir. When the reservoir is filled with molten solder, the solder is drawn via capillary action into a precisely defined narrow gap between two components of the housing where it forms an airtight and vacuum-tight seal.

Frisch, Henry J.↗
NASA NTRS1966

Soldering tool heats workpieces and applies solder in one operation

Fountain-pen type soldering iron heats workpieces and applies solder to joints in densely packed electronics assemblies. The basic soldering tool is used with different-sized orifice tips, eliminating the need for an assortment of conventional soldering guns.

Gudkese, V. W.↗
DOE OSTI2021

Method and device for a high temperature vacuum-safe solder resist utilizing laser ablation of solderable surfaces for an electronic module assembly

A process for manufacturing an electronic component having attaches includes providing a first component having a first attach, forming trenches on a portion of the first attach with a laser to form a solder stop, and providing a second component comprising a second attach. The process further includes providing solder between the first attach and the second attach to form a connection between the first component and the second component, where the trenches contain the solder to a usable area. A device produced by the process is disclosed as well.

Stabach, Jennifer↗
DOE OSTI2020

Activation Energy for End-of-Life Solder Bond Degradation: Thermal Cycling of Field-Aged PV Modules

The longevity of solar photovoltaic modules depends on the durability and reliability of their components, one of which is the solder bonds in interconnect ribbons. The solder joints experience stresses from thermal cycling and constant elevated temperatures (40 °C-70 °C) in regular field operation leading to thermo-mechanical fatigue and intermetallic compound formation. To study the end-of-life wear-out mechanisms and to obtain activation energy of solder bond degradation, here two field-aged modules from Arizona-a 21-year-old Solarex MSX60 module (with Sn62Pb36Ag2 at the solder joints) and an 18-year-old Siemens M55 module (with Sn60Pb40 at the solder joints)-underwent 800 and 400 modified thermal cycles, respectively. Using three heating blankets, each module had three temperature zones maintained at 85, 95, and 105 °C during the 15-min hot dwell time of the thermal cycle. Cell-level series resistance data obtained from three temperature zones enabled the calculation of activation energy for solder bond degradation for the MSX60 and the M55 modules to be 0.12 eV and 0.35 eV, respectively. From each temperature zone in both modules, busbar-solder samples were obtained, imaged through SEM, and analyzed with energy-dispersive X-ray spectroscopy. In the MSX60 module with traces of Ag in the solder material, phase segregation and growth were primarily observed at high temperatures. For M55 modules without Ag in the solder material, major phase segregation was observed in all temperature zones. The IMC thickness for both modules increased with increasing module temperature. The beneficial effect of Ag in solder material on mitigating solder bond degradation is presented.

14 SOLAR ENERGY↗
DOE OSTI2024

Microstructural Coarsening Kinetics and Mechanical Property Changes in Long-Term Aged Sn–Pb–Sb Solder Joints

Tin-lead-antimony (50Sn–47Pb–3Sb wt.%) soldered assemblies were mechanically tested approximately 30 years after initial production and found to have solder joints of reduced strength. The microstructure of this solder alloy exhibits a ternary eutectic structure with Sn-rich, Pb-rich, and SnSb phases. Accelerated aging was performed to evaluate solder microstructural coarsening and associated strength of laboratory solder joints to correlate these properties to the “naturally aged” solder joints. Isothermal aging was conducted at room temperature, 55, 70, 100, and 135 °C and aging times that ranged from 0.1 to 365 days. The coarsening kinetics of the Pb-rich phase were determined through optical microscopy and image analysis methods established in previous studies on binary Sn–Pb solder. A kinetic equation was developed with time exponent n of 0.43 and activation energy of 24000 J/mol, suggesting grain boundary diffusion or other fast diffusion pathways controlling the microstructural evolution. Compression testing and Vickers microhardness showed significant strength loss within the first 20–30 days after soldering; then, the microstructure and mechanical properties changed more slowly over long periods of time. Further, by combining accelerated aging data and the microstructure-based kinetics, strength predictions were made that match well with the properties of the actual soldered assemblies naturally aged for 30 years. However, aging at the highest temperature of 135 °C produced anomalous behavior suggesting that extraneous aging mechanisms are active. Therefore, data obtained at this temperature or higher should not be used. Overall, the combined microstructural and mechanical property methods used in this study confirmed that the observed reduction in strength of ~ 30-year-old solder joints can be accounted for by the microstructural coarsening that takes place during long-term solid-state aging.

36 MATERIALS SCIENCE↗
NASA NTRS1985

NTF: Soldering Technology Development for Cryogenics

The advent of the National Transonic Facility (NTF) brought about a new application for an old joining method, soldering. Soldering for use at cryogenic temperatures requires that solders remain ductile and free from tin-pest (grey tin), have toughness to withstand aerodynamic loads associated with flight research, and maintain their surface finishes. Solders are used to attach 347 Stainless-Steel tubing in surface grooves of models. The solder must fill up the gap and metallurgically bound to the tubing and model. Cryogenic temperatures require that only specific materials for models can be used, including: Vasco Max 200 CVM, lescalloy A-286 Vac Arc, pH 13-8 Mo. Solders identified for testing at this time are: 50% Sn - 49.5% Pb - 0.5% Sb, 95% Sn - 5% Sb, 50% In 50% Pb, and 37.5% Sn - 37.5% Pb - 25% In. With these materials and solders, it is necessary to determine their solderability. After solderability is determined, tube/groove specimens are fabricated and stressed under cryogenic temperatures. Compatible solders are then used for acutual models.

Hall, E. T., Jr.↗
NASA NTRS2012

Modified Process Reduces Porosity when Soldering in Reduced Gravity Environments

A modified process yields lower levels of internal porosity for solder joints produced in reduced-gravity environments. The process incorporates both alternative materials and a modified procedure. The process provides the necessary cleaning action to enable effective bonding of the applied solder alloy with the materials to be joined. The modified process incorporates a commercially available liquid flux that is applied to the solder joint before heating with the soldering iron. It is subsequently heated with the soldering iron to activate the cleaning action of the flux and to evaporate most of the flux, followed by application of solder alloy in the form of commercially available solid solder wire (containing no flux). Continued heating ensures adequate flow of the solder alloy around and onto the materials to be joined. The final step is withdrawal of the soldering iron to allow alloy solidification and cooling of the solder joint.

Watson, Kevin↗
NASA NTRS2021

Effect of Soldering on Polymer and MnO2 Tantalum Capacitors

Soldering might have a strong effect on performance and reliability of most surface mount technology components, including tantalum capacitors. High quality tantalum capacitors are likely the only type of components where soldering simulation is the first step during screening. Nevertheless, post-soldering failures of tantalum capacitors happen and require additional analysis. Popcorning is a well-known effect in plastic encapsulated microcircuits (PEM) and it occurs also in chip tantalum capacitors. The sensitivity of parts to the presence of moisture during soldering is characterized by the moisture sensitivity level (MSL); however, contrary to PEMs, there is no standard procedure for establishing MSL for tantalum capacitors. The effect of absorbed moisture on soldering related degradation and failures in tantalum capacitors have not been studied properly yet, and there is no sufficient information regarding the difference in the sensitivity to soldering between polymer and MnO2 tantalum capacitors. In this work, 16 types of polymer and 9 types of MnO2 cathodes tantalum capacitors with different moisture content have been tested before and after reflow soldering. The level of moisture release after soldering has been estimated and thermo-mechanical analysis used to assess deformation of capacitors during soldering simulations. Results show that moisture uptake in similar parts is approximately two times greater in polymer than in MnO2 capacitors. Cracking of the case and degradation of parameters can occur in both types of parts, but MnO2 capacitors are much more likely to fail catastrophically with a short circuit and possible ignition during the first power-on cycle. This type of failure in MnO2 capacitors is lot-related, can occur even at derated voltages and relatively low levels of moisture sorption corresponding to room conditions. Baking before soldering is an effective measure to prevent failures even in lots susceptible to popcorning damage. Recommendations for baking and testing to establish MSL are suggested.

Alexander Teverovsky↗
NASA NTRS2005

Soldering Tested in Reduced Gravity

Whether used occasionally for contingency repair or routinely in nominal repair operations, soldering will become increasingly important to the success of future long-duration human space missions. As a result, it will be critical to have a thorough understanding of the service characteristics of solder joints produced in reduced-gravity environments. The National Center for Space Exploration Research (via the Research for Design program), the NASA Glenn Research Center, and the NASA Johnson Space Center are conducting an experimental program to explore the influence of reduced gravity environments on the soldering process. Solder joint characteristics that are being considered include solder fillet geometry, porosity, and microstructural features. Both through-hole (see the drawing and image on the preceding figure) and surface-mounted devices are being investigated. This effort (the low-gravity portion being conducted on NASA s KC-135 research aircraft) uses the soldering hardware currently available on the International Space Station. The experiment involves manual soldering by a contingent of test operators, including both highly skilled technicians and less skilled individuals to provide a skill mix that might be encountered in space mission crews. The experiment uses both flux-cored solder and solid-core solder with an externally applied flux. Other experimental parameters include the type of flux, gravitational level (nominally zero,

Struk, Peter M.↗
DOE OSTI2020

Activation Energy for Solder Bond Degradation: Thermal Cycling of Field-aged Modules at Multiple Upper Temperatures

The reliability of solder joints in the solar cell metallization-interconnect system influences the lifetime of photovoltaic modules. Two field-aged modules-one with Sn 62 Pb 36 Ag 2 solder at the solder joints (Solarex MSX 60), and the other with the standard Sn 60 Pb 40 solder (Siemens M55)-were subjected to a modified thermal cycling (TC) test of IEC 61215. Three sections in each module were maintained at 85 degrees C, 95 degrees C, and 105 degrees C during the 15-minute high temperature dwell time. Current equivalent to the module short-circuit current was injected through the module when the chamber temperature was above 25 degrees C to simulate regular field operation. This novel approach aims to induce thermomechanical fatigue (TMF) at the solder joints and intermetallic compound (IMC) formation at the metal/solder interfaces. The activation energy (E a ) for solder bond degradation was calculated based on the series resistance (R s ) increase in TC testing rather than power drop to avoid the effect of confounding variables. Module-level R s increase in MSX 60 module after TC800 cycles and in M55 module after TC400 cycles was 1.22% and 183.7%, respectively. The E a determined for the module with 2wt% Ag is 0.24 eV and for that with the standard solder is 0.27 eV. The solder bond degradation seems to have been driven by TMF rather than IMC formation for both modules.

14 SOLAR ENERGY↗