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Omnidirectional Inter-Satellite Optical Communicator (ISOC)

The objective of the Omnidirectional Inter-Satellite Optical Communicator (ISOC) project is to design a compact, lightweight,and energy efficient communicator module for use between satellites in space. This module will achieve continuous optical communication, with simultaneous data transmission and reception, at up to1 gigabit per second (Gbits) data rates for small spacecraft separated by up to 200 kilometers (kms). To achieve this goal,a data communicator with full spherical coverage field of view (FOV) needs to be designed. The proposed ISOC is a dodecahedron geometric array of chipscale, microelectromechanical systems (MEMS) based gimbal-less scanning mirrors that provide adjustable beam pointing and spherical FOV coverage for uninterrupted data transmission between several small spacecraft at arbitrary relative positions. This design eliminates known pointing issues and hence allows accurate direction of arrival calculations.Moreover, the proposed approach will enable data relaying between multiple satellites, and enable relative navigation control.

Inter-small satellite communication

Chip Scale Package Integrity Assessment by Isothermal Aging

Many aspects of chip scale package (CSP) technology, with focus on assembly reliability characteristics, are being investigated by the JPL-led consortia. Three types of test vehicles were considered for evaluation and currently two configurations have been built to optimize attachment processes.

chipscale

Chip Scale Package Implementation Challenges

The JPL-led MicrotypBGA Consortium of enterprises representing government agencies and private companies have joined together to pool in-kind resources for developing the quality and reliability of chip scale packages (CSPs) for a variety of projects.

chipscale