NASA NTRS · 20210002683
SM Package Miniaturization Trends and Assembly Reliability Challenges
Abstract
Different aspects of advanced surface mount package technology have been investigated. Three key areas included the assembly reliability of conventional Surface Mount (SM), Ball Grid Arrays (BGAs), and Chip Scale Packages (CSPs).
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Ghaffarian, R.. 1999-05-23. SM Package Miniaturization Trends and Assembly Reliability Challenges. https://ntrs.nasa.gov/citations/20210002683
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