NASA NTRS · 20060034610
BGAs for High Reliability Applications
Abstract
Ball Grid Array (BGA) is an important technology for utilizing higher pin counts, without the attendant handling and processing problems of the peripheral leaded packages. They are also robust in processing because of their higher pitch (0.050 inches typical), better lead rigidity, and self-alignment characteristics during reflow processing.
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Ghaffarian, R.. 1998-03-01. BGAs for High Reliability Applications. https://ntrs.nasa.gov/citations/20060034610
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